JPH06143261A - Resin-impregnated base and electrical laminate - Google Patents
Resin-impregnated base and electrical laminateInfo
- Publication number
- JPH06143261A JPH06143261A JP29537492A JP29537492A JPH06143261A JP H06143261 A JPH06143261 A JP H06143261A JP 29537492 A JP29537492 A JP 29537492A JP 29537492 A JP29537492 A JP 29537492A JP H06143261 A JPH06143261 A JP H06143261A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- impregnated
- added
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 239000002966 varnish Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 229920013822 aminosilicone Polymers 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- OBFQBDOLCADBTP-UHFFFAOYSA-N aminosilicon Chemical group [Si]N OBFQBDOLCADBTP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- ARLJCLKHRZGWGL-UHFFFAOYSA-N ethenylsilicon Chemical compound [Si]C=C ARLJCLKHRZGWGL-UHFFFAOYSA-N 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- -1 polyacrylic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高信頼化対策と
して耐スミア性が要求されている。このため電気用積層
板の穴明け工程においては細心の注意が必要とされ、作
業能率を著しく低下させている。2. Description of the Related Art In recent years, smear resistance has been required as a measure for increasing the reliability of electrical and electronic equipment. For this reason, meticulous attention is required in the process of punching the electrical laminate, which significantly reduces the work efficiency.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、耐スミア性を良くするために穴明け工程の作業能
率は著しく低下する。本発明は従来の技術における上述
の問題点に鑑みてなされたもので、その目的とするとこ
ろは穴明け工程の作業能率を低下させることなく耐スミ
ア性を向上させる樹脂含浸基材、電気用積層板を提供す
ることにある。As described in the prior art, the work efficiency of the drilling process is remarkably reduced in order to improve the smear resistance. The present invention has been made in view of the above problems in the prior art, and an object thereof is a resin-impregnated base material for improving smear resistance without lowering work efficiency of a punching process, and an electrical laminate. To provide a plate.
【０００４】[0004]
【課題を解決するための手段】本発明はアミノシリコン
付加エポキシ樹脂とビニルシリコンとを反応させてなる
エポキシ樹脂に硬化剤を加え、更に必要に応じて硬化促
進剤、溶剤等を添加したエポキシ樹脂ワニスに基材を含
浸、乾燥した樹脂含浸基材及び該樹脂含浸基材の所要枚
数の上面及び又は下面に金属箔を配設ー体化してなるこ
とを特徴とする電気用積層板のため、上記目的を達成す
ることができたもので、以下本発明を詳細に説明する。The present invention is an epoxy resin obtained by adding a curing agent to an epoxy resin obtained by reacting an aminosilicon-added epoxy resin with vinyl silicone, and further adding a curing accelerator, a solvent, etc., if necessary. A varnish is impregnated with a base material, and a resin-impregnated base material obtained by drying and a metal foil is disposed on the upper surface and / or the lower surface of the required number of the resin-impregnated base material and formed into a body. Now that the above object has been achieved, the present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂は、アミノシ
リコン付加エポキシ樹脂とビニルシリコンとを反応させ
てなるエポキシ樹脂である。アミノシリコン付加エポキ
シ樹脂としては、ビスフェノ−ルＡ型エポキシ樹脂、オ
ルソクレゾールノボラック型エポキシ樹脂等のエポキシ
樹脂に、アミノ基当量３００〜３０００程度のオルガノ
ポリシロキサン等を付加反応させたものである。硬化剤
としてはフェノ−ル樹脂、イソシアネート、アミン系硬
化剤、酸無水物、ルイス酸錯化合物、イミダゾール系化
合物等が用いられ特に限定しない。必要に応じて硬化促
進剤としては、燐系、３級アミン系硬化促進剤が用いら
れる。必要に応じて溶剤としてはケトン系、アルコール
系等のように樹脂と相溶するものを用いることができ特
に限定しない。更に必要に応じてタルク、クレー、シリ
カ、炭酸カルシュウム、水酸化アルミニゥム、三酸化ア
ンチモン、五酸化アンチモン等の無機質粉末充填剤、ガ
ラス繊維、アスベスト繊維、パルプ繊維、合成繊維、セ
ラミック繊維等の繊維質充填剤、着色剤等を添加するこ
とができる。基材としてはガラス、アスベスト等の無機
質繊維、ポリエステル、ポリアミド、ポリアクリル、ポ
リビニルアルコール、ポリイミド、フッ素樹脂等の有機
質繊維、木綿等の天然繊維の織布、不織布、紙、マット
等を用いることができる。基材に対する含浸は同一の樹
脂のみによる含浸でもよいが、同系樹脂又は異系樹脂に
よる１次含浸、２次含浸というように含浸を複数にし、
より含浸が均一になるようにすることもできる。かくし
て基材に樹脂を含浸、乾燥して樹脂含浸基材を得るもの
である。金属箔としては銅、アルミニュウム、真鍮、ニ
ッケル、鉄等の単独、合金、複合箔を用いることができ
る。このようにして上記樹脂含浸基材の所要枚数の上面
及び又は下面に金属箔を配設ー体化して電気用積層板を
得るものである。以下本発明を実施例に基づいて説明す
る。The epoxy resin used in the present invention is an epoxy resin obtained by reacting an aminosilicon-added epoxy resin with vinylsilicon. As the aminosilicon-added epoxy resin, an epoxy resin such as a bisphenol A type epoxy resin or an orthocresol novolac type epoxy resin is subjected to an addition reaction with an organopolysiloxane having an amino group equivalent of about 300 to 3000. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, a solvent that is compatible with the resin, such as a ketone-based solvent or an alcohol-based solvent, can be used and is not particularly limited. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, and fiber materials such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber and ceramic fiber. Fillers, colorants and the like can be added. As the base material, it is possible to use glass, inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide and fluororesin, woven cloth of natural fibers such as cotton, non-woven fabric, paper and mat. it can. The base material may be impregnated only with the same resin, but multiple impregnations such as primary impregnation and secondary impregnation with the same resin or different resin,
It is also possible to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.
【０００６】[0006]
【実施例】エポキシ当量１９５のクレゾールノボラック
型エポキシ樹脂１３０部（以下単に部と記す）に、アミ
ノ基当量２４００の末端アミノシリコン７部を加え、１
４０℃で３時間加熱反応し、次いで末端ビニル変性シリ
コン２３部、ｔ−ブチルクミルパーオキサイド０．２部
を加え１４０℃で１時間加熱反応して得たエポキシ樹脂
１６０部に対し、ジシアンジアミド４部、ベンジルジメ
チルアミン０．２部、メチルオキシトール１０0 部を添
加したエポキシ樹脂ワニスに、厚み０．０１８ｍｍの平
織ガラス布を樹脂付着量が４５％になるように含浸、乾
燥して樹脂含浸基材を得た。次に該樹脂含浸基材８枚を
重ねた上下面に厚み０．０３５ｍｍの銅箔を各々配設し
た積層体を成形圧力４０Ｋｇ／ｃｍ2 、１６０℃で９０
分間加熱加圧成形して厚み１．６ｍｍの両面銅張り積層
板を得た。Example To 130 parts of a cresol novolac type epoxy resin having an epoxy equivalent of 195 (hereinafter simply referred to as "part"), 7 parts of terminal aminosilicon having an amino group equivalent of 2400 was added, and 1
After heat-reacting at 40 ° C. for 3 hours, 23 parts of terminal vinyl-modified silicon and 0.2 part of t-butylcumyl peroxide were added, and heat-reacting at 140 ° C. for 1 hour to obtain 160 parts of an epoxy resin, and 4 parts of dicyandiamide. Epoxy resin varnish containing 0.2 parts of benzyl dimethylamine and 100 parts of methyl oxitol impregnated with a plain weave glass cloth having a thickness of 0.018 mm to a resin adhesion of 45% and dried to obtain a resin-impregnated base material. Got Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on each of the upper and lower surfaces of the eight resin-impregnated base materials, is molded at a molding pressure of 40 Kg / cm 2 and at 160 ° C. for 90 minutes.
It was heat and pressure molded for 1 minute to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm.
【０００７】[0007]
【比施例】エポキシ当量２１０、粘度１００００ｃｐｓ
のビスフェノ−ルＡ型エポキシ樹脂１００部に対し、ジ
シアンジアミド４部、ベンジルジメチルアミン０．２
部、メチルオキシトール１００部を添加したエポキシ樹
脂ワニスを用いた以外は実施例と同様に処理して樹脂含
浸基材を得ると共に厚み１．６ｍｍの両面銅張り積層板
を得た。[Comparative Example] Epoxy equivalent 210, viscosity 10000 cps
Bisphenol A type epoxy resin of 100 parts, dicyandiamide of 4 parts and benzyldimethylamine of 0.2 parts
Parts and a resin-impregnated base material were obtained in the same manner as in the example except that an epoxy resin varnish added with 100 parts of methyl oxitol was used to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm.
【０００８】実施例及び比較例の電気用積層板をドリル
で開穴しスルホール加工した耐スミア性は表１のようで
ある。Table 1 shows the smear resistance of the electrical laminates of Examples and Comparative Examples, which were formed by drilling holes and through holes.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板は耐スミア性がよく、本発明の優れ
ていることを確認した。The present invention is constructed as described above.
It was confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good smear resistance and is excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｇ 7011−4Ｅ // Ｂ２９Ｋ 63:00 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/03 G 7011-4E // B29K 63:00 105: 06
Claims (2)
シリコンとを反応させてなるエポキシ樹脂に硬化剤を加
え、更に必要に応じて硬化促進剤、溶剤等を添加したエ
ポキシ樹脂ワニスに基材を含浸、乾燥したことを特徴と
する樹脂含浸基材。1. A base material is impregnated with an epoxy resin varnish obtained by adding a curing agent to an epoxy resin obtained by reacting an aminosilicon-added epoxy resin and vinyl silicone, and further adding a curing accelerator, a solvent, etc., if necessary. A resin-impregnated base material characterized by being dried.
シリコンとを反応させてなるエポキシ樹脂に硬化剤を加
え、更に必要に応じて硬化促進剤、溶剤等を添加したエ
ポキシ樹脂ワニスに基材を含浸、乾燥した樹脂含浸基材
の所要枚数の上面及び又は下面に金属箔を配設ー体化し
てなることを特徴とする電気用積層板。2. A base material is impregnated into an epoxy resin varnish containing a curing agent added to an epoxy resin obtained by reacting an aminosilicone-added epoxy resin with vinylsilicone and, if necessary, a curing accelerator and a solvent. An electrical laminate comprising: a metal foil disposed on and integrated with a required number of dried resin-impregnated base materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537492A JPH06143261A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537492A JPH06143261A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06143261A true JPH06143261A (en) | 1994-05-24 |
Family
ID=17819804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29537492A Pending JPH06143261A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06143261A (en) |
-
1992
- 1992-11-04 JP JP29537492A patent/JPH06143261A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06143261A (en) | Resin-impregnated base and electrical laminate | |
| JP2006348187A (en) | Resin composition and prepreg and copper-clad laminate using the same | |
| JPH0680803A (en) | Resin-impregnated base material and electrical laminate | |
| JPH06143260A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143259A (en) | Resin-impregnated base and electrical laminate | |
| JP3561359B2 (en) | Prepreg sheet and laminated products | |
| JPH05309781A (en) | Electric laminated sheet | |
| JPH06143265A (en) | Resin-impregnated base and electrical laminate | |
| JPH09143247A (en) | Resin composition for laminate, prepreg and laminate | |
| JPH06143269A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143268A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143263A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143267A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143266A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143262A (en) | Resin-impregnated base and electrical laminate | |
| JPH06116412A (en) | Resin-impregnated base and electrical laminate | |
| JPH05315716A (en) | Electrical laminate plate | |
| JPH06143258A (en) | Resin-impregnated base and electrical laminate | |
| JPH06143264A (en) | Resin-impregnated base and electrical laminate | |
| JPH06116415A (en) | Resin-impregnated base and electrical laminate | |
| JPH06116414A (en) | Resin-impregnated base and electrical laminate | |
| JPH06114831A (en) | Resin impregnated base and laminated board for electricity | |
| JPH06116411A (en) | Resin-impregnated base and electrical laminate | |
| WO1992022422A1 (en) | Shape retaining flexible electrical circuit | |
| JPH06116413A (en) | Resin-impregnated base and electrical laminate |