JPH0648876Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0648876Y2
JPH0648876Y2 JP1989088726U JP8872689U JPH0648876Y2 JP H0648876 Y2 JPH0648876 Y2 JP H0648876Y2 JP 1989088726 U JP1989088726 U JP 1989088726U JP 8872689 U JP8872689 U JP 8872689U JP H0648876 Y2 JPH0648876 Y2 JP H0648876Y2
Authority
JP
Japan
Prior art keywords
lead frame
additional function
wiring board
printed wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989088726U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328756U (mo
Inventor
孝司 川久保
雄司 八代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989088726U priority Critical patent/JPH0648876Y2/ja
Publication of JPH0328756U publication Critical patent/JPH0328756U/ja
Application granted granted Critical
Publication of JPH0648876Y2 publication Critical patent/JPH0648876Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1989088726U 1989-07-27 1989-07-27 半導体装置 Expired - Fee Related JPH0648876Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989088726U JPH0648876Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989088726U JPH0648876Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH0328756U JPH0328756U (mo) 1991-03-22
JPH0648876Y2 true JPH0648876Y2 (ja) 1994-12-12

Family

ID=31638322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989088726U Expired - Fee Related JPH0648876Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Country Status (1)

Country Link
JP (1) JPH0648876Y2 (mo)

Also Published As

Publication number Publication date
JPH0328756U (mo) 1991-03-22

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Legal Events

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