JPH067587B2 - Solid-state imaging device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a solid-state imaging device, and more particularly to a solid-state imaging device in which a solid-state imaging element or the like is sealed with a mold resin.

[Prior Art] FIG. 3 is a sectional view showing a conventional solid-state imaging device.

In the figure, a solid-state imaging device 10 includes a wafer substrate 11,
The light receiving area 12 is formed on the surface of the wafer substrate 11. The package 30 includes a package body 31 made of ceramic, a bottom plate 32 made of Kovar, 42 alloy, etc., and external leads 3 made of 42 alloy for taking out an electric signal of the solid-state imaging device 10 to the outside.
3 and 3. The solid-state image sensor 10 is die-bonded to the bottom plate 32 with an epoxy resin 40 while adjusting the position and inclination of the solid-state image sensor 10 with high accuracy. This die bonding is performed by applying an epoxy resin 40 between the bottom plate 32 and the wafer substrate 11 and heating the epoxy resin 40 at a low temperature. The solid-state imaging device 10 is wire-bonded to the external lead 33 by the thin metal wire 5. The color filter 20 is
It is composed of an optical glass 21 and a filter layer 22 formed on the surface of the optical glass 21. The color filter 20 is arranged so that the filter layer 22 is accurately positioned on the light receiving region 12, the adhesive 41 is applied between the solid-state imaging device 10 and the color filter 20, and the adhesive 41 is irradiated with ultraviolet rays. Solid-state image sensor 1 by heating
It is solidified by bonding it to the 0 surface. The glass lid 60 with metal is a metal frame 6 made of Kovar, 42 alloy, or the like.
1 and optical glass 62. A metal-equipped glass lid 60 is provided on the upper part of the package body 31, and the package 30 is provided by the metal-equipped glass lid 60.
A solid-state image sensor 10, a color filter 20,
The thin metal wire 5 is sealed to protect these components from the outside air.

[Problems to be Solved by the Invention] In the conventional solid-state imaging device, since the package main body 31 is made of ceramic, cracks and chips of the ceramic occur, and foreign matters such as ceramic chips are generated. There has been a problem that the solid-state image sensor 10 enters the light receiving region 12 to cause an image defect of the solid-state image sensor 10.

In addition, the price of the package body 31 and the glass lid 60 with metal is high.

Further, in the conventional solid-state image pickup device, the color filter 20 is bonded and fixed by the adhesive 41 applied over the entire surface of the solid-state image pickup device 10. For this reason, the light transmitted through the color filter 20 is not absorbed by the adhesive 41.
Therefore, there is a problem that the light sensitivity is poor because the light is not absorbed by or polarized by and does not reach the light receiving region 12 of the solid-state imaging device 10 sufficiently.

Further, since most of the color filter 20 is in direct contact with the adhesive 41, it is easily affected by the adhesive 41, the color filter 20 is deformed due to the warp due to the difference in the linear expansion coefficient, and the pigment of the color filter 20 is There was a problem of discoloration.

The present invention has been made in order to solve the above-mentioned conventional problems, and is a solid-state imaging device which has no image defects, is highly reliable, and is inexpensive, and further has good photosensitivity. An object of the present invention is to obtain a high-performance solid-state imaging device in which the color filter is not deformed or discolored.

[Means for Solving Problems] A solid-state image pickup device according to the present invention includes a resin provided on a surface of the solid-state image pickup element so as to surround a light receiving region of the solid-state image pickup element.
The solid-state image sensor is die-bonded to the mount part of the lead frame, the solid-state image sensor and the external lead of the lead frame are connected with a thin metal wire, and a space is formed on the light-receiving region of the solid-state image sensor, so that the solid-state image sensor is mounted on the solid-state image sensor. A color filter is provided via a resin, and the mount portion, a part of the external lead, the solid-state image sensor, the thin metal wire, the resin, and the color filter are integrally sealed with a molding resin.

[Operation] In the present invention, the color filter is used like a sealing glass lid without using the expensive package body made of ceramic and the glass lid with metal, and the solid-state imaging device, the color filter, and the like are inexpensively molded. Since it is sealed with resin, image defects of the solid-state image pickup element due to foreign matters such as ceramic chips do not occur, and the solid-state image pickup device becomes inexpensive.

Further, according to the present invention, the color filter is not provided by the adhesive applied over the entire surface of the solid-state image sensor, but the resin is provided on the solid-state image sensor so that a space is formed on the light receiving area of the solid-state image sensor. Since the color filter is provided through the color filter, the light transmitted through the color filter reaches the light receiving region of the solid-state image sensor through the space formed between the solid-state image sensor and the color filter without being absorbed or polarized. . Therefore, the photosensitivity of the solid-state imaging device is further improved.

Further, in the present invention, since the color filter only partially contacts the resin provided on the surface of the solid-state image sensor so as to surround the light receiving area of the solid-state image sensor, the color filter is hardly affected by the resin and the difference in linear expansion coefficient is large. It is possible to avoid the deformation due to the warp of the color filter and the discoloration of the pigment of the color filter.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. In addition,
In the description of this embodiment, the description overlapping with the description of the conventional technique will be appropriately omitted.

FIG. 1A is a plan view of a wafer on which a solid-state image sensor of a solid-state image sensor according to an embodiment of the present invention is manufactured.
FIG. B is a sectional view taken along the line AA of FIG. 1A.

In the figure, a plurality of light receiving regions 12 are formed on the surface of the wafer 1, and a frame-shaped screen resin 7 is printed on the surface of the wafer 1 so as to surround each light receiving region 12. The wafer 1 on which the pattern is formed as described above is diced along the dicing line 2 and separated into each solid-state image sensor 10 including the wafer substrate 11 and the light receiving region 12.

FIG. 2 is a sectional view showing a solid-state image pickup device which is an embodiment of the present invention.

In the figure, the lead frame 90 is composed of a mount portion 91 and an external lead 92 made of 42 alloy or the like. The solid-state imaging device 10 separated from the wafer 1 by dicing is die-bonded to the mount portion 91 with the epoxy resin 40 while adjusting the position and inclination of the solid-state imaging device 10 with high accuracy. This die bonding is performed by applying an epoxy resin 40 between the mount portion 91 and the wafer substrate 11 and heating the epoxy resin 40 at a low temperature. Solid-state image sensor 10
Is wire-bonded to the external lead 92 for taking out the electric signal of the solid-state imaging device 10 by the thin metal wire 5. A color filter 20 is provided on the solid-state imaging device 10 via a screen resin 7 provided on the surface of the wafer substrate 11 so as to surround the light receiving region 12, and the filter layer 22 is accurately positioned on the light receiving region 12. Are arranged as follows.

A color filter 20 is provided on the solid-state imaging device 10 via a screen resin 7 provided on the surface of the wafer substrate 11 so as to surround the light receiving region 12, and a filter layer 22.
Are arranged on the light receiving region 12 with high accuracy. As a result, a space having a height substantially equal to the thickness of the screen resin 7 is formed between the light receiving area 12 of the solid-state image sensor 10 and the filter layer 22 of the color filter 20. As described above, the surface of the wafer substrate 11 is formed so that the color filter 20 is not adhered to the surface of the solid-state imaging device 10 by the adhesive, but a space is formed on the light-receiving region 12 of the solid-state imaging device 10. Through the frame-shaped screen resin 7 provided on the color filter 20.
Since the light is transmitted through the color filter 20, the light transmitted through the color filter 20 is not absorbed or polarized and passes through the space provided between the light receiving region 12 of the solid-state imaging device 10 and the filter layer 22 of the color filter 20. Reach twelve. Therefore, the photosensitivity of the solid-state imaging device is further improved.

Furthermore, since the color filter 20 only partially contacts the screen resin 7 provided on the surface of the wafer substrate 11 so as to surround the light receiving region 12 of the solid-state image sensor 10, it is less affected by the screen resin 7 and the linear expansion. The deformation of the color filter 20 due to the difference in the coefficient, the color change of the pigment of the color filter 20, and the like can be discarded.

In addition, the mount portion 91, a part of the external leads 92, the solid-state imaging device 10, the thin metal wire 5, the screen resin 7,
The color filter 20 is integrally sealed with an inexpensive molding resin 8 to protect these components from the outside air. When molding this molding resin 8,
In the screen resin 7, the mold resin 8 is the solid-state imaging device 1
It is prevented that the light receiving area 12 of 0 is invaded.

As described above, the color filter 20 is used like a sealing glass lid without using the expensive package body 31 made of ceramic and the glass lid 60 with metal, and the solid-state imaging device 10, the color filter 20, and the like are inexpensive. Since it is sealed with the mold resin 8, image defects of the solid-state imaging device 10 due to foreign matter such as ceramic chips do not occur, and the solid-state imaging device becomes inexpensive.

[Effects of the Invention] As described above, according to the present invention, a color filter is used like a glass lid for sealing without using an expensive package body made of ceramic and a glass lid with metal, and a solid-state image sensor, Since the resin is sealed with an inexpensive molding resin such as a color filter, it is possible to obtain a highly reliable and inexpensive solid-state imaging device without image defects.

Further, according to the present invention, the color filter is not adhered by the adhesive which is entirely applied to the surface of the solid-state image sensor, but the space is formed on the light receiving area of the solid-state image sensor. Since the color filter is provided through the resin provided in the above, it is possible to obtain a high-performance solid-state imaging device that has good photosensitivity and does not cause deformation or discoloration of the color filter.

[Brief description of drawings]

FIG. 1A is a plan view of a wafer on which a solid-state image sensor of a solid-state image sensor according to an embodiment of the present invention is manufactured.
FIG. B is a sectional view taken along the line AA of FIG. 1A. FIG. 2 is a sectional view showing a solid-state image pickup device which is an embodiment of the present invention. FIG. 3 is a sectional view showing a conventional solid-state imaging device. In the figure, 1 is a wafer, 2 is a dicing line, 5 is a fine metal wire, 7 is a screen resin, 8 is a mold resin, 1
Reference numeral 0 is a solid-state image sensor, 11 is a wafer substrate, 12 is a light receiving region, 20 is a color filter, 21 is optical glass, 22 is a filter layer, 40 is an epoxy resin, 90 is a lead frame, 91 is a mount portion, and 92 is external. Be the lead. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (2)

[Claims] 1. A solid-state imaging device including a light-receiving region, a resin provided on the surface of the solid-state imaging device so as to surround the light-receiving region of the solid-state imaging device, and a space formed on the light-receiving region of the solid-state imaging device. ,
A lead frame including a color filter provided on the solid-state imaging device via a resin, a mount portion for die-bonding the solid-state imaging device, and an external lead for taking out an electric signal of the solid-state imaging device to the outside. A metal thin wire for connecting the solid-state imaging device and the external lead, the mount portion, a part of the external lead, the solid-state imaging device, the metal thin wire, the resin, and the collar. A solid-state imaging device comprising a mold resin that integrally seals a filter. 2. The color filter is composed of an optical glass and a filter layer formed on the surface of the optical glass, and the filter layer is arranged so as to be located on the light receiving region. The solid-state imaging device according to item 1.