JPH0710517Y2 - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPH0710517Y2
JPH0710517Y2 JP1989090551U JP9055189U JPH0710517Y2 JP H0710517 Y2 JPH0710517 Y2 JP H0710517Y2 JP 1989090551 U JP1989090551 U JP 1989090551U JP 9055189 U JP9055189 U JP 9055189U JP H0710517 Y2 JPH0710517 Y2 JP H0710517Y2
Authority
JP
Japan
Prior art keywords
substrate
terminals
terminal
dil
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989090551U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0330457U (pt
Inventor
健志 池戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP1989090551U priority Critical patent/JPH0710517Y2/ja
Publication of JPH0330457U publication Critical patent/JPH0330457U/ja
Application granted granted Critical
Publication of JPH0710517Y2 publication Critical patent/JPH0710517Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
JP1989090551U 1989-08-01 1989-08-01 混成集積回路 Expired - Lifetime JPH0710517Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989090551U JPH0710517Y2 (ja) 1989-08-01 1989-08-01 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989090551U JPH0710517Y2 (ja) 1989-08-01 1989-08-01 混成集積回路

Publications (2)

Publication Number Publication Date
JPH0330457U JPH0330457U (pt) 1991-03-26
JPH0710517Y2 true JPH0710517Y2 (ja) 1995-03-08

Family

ID=31640068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989090551U Expired - Lifetime JPH0710517Y2 (ja) 1989-08-01 1989-08-01 混成集積回路

Country Status (1)

Country Link
JP (1) JPH0710517Y2 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009233297A (ja) * 2008-03-25 2009-10-15 Akira Okada 干し回る君

Also Published As

Publication number Publication date
JPH0330457U (pt) 1991-03-26

Similar Documents

Publication Publication Date Title
EP0346035B1 (en) Terminal structure and process of fabricating the same
US5588205A (en) Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5610436A (en) Surface mount device with compensation for thermal expansion effects
JPH05206688A (ja) 半導体装置とその面実装方法
KR100895964B1 (ko) 저 프로파일 집적 모듈 상호접속들
JPH09289052A (ja) モジュールの実装構造
JPH03145186A (ja) 半導体モジュール
JPS60260192A (ja) 混成集積回路の製造方法
US4536825A (en) Leadframe having severable fingers for aligning one or more electronic circuit device components
JPS617692A (ja) 導体ピンの固着方法および導体ピン固着のプリント配線板
JPH02151095A (ja) 基板に対するｉｃの実装方法およびｉｃ実装基板
JP2655118B2 (ja) 半導体装置
JPH04276649A (ja) 複合形半導体装置およびその実装構造体並びにその実装方法
JP2503873B2 (ja) 集積回路パッケ―ジの構造
JPH05327161A (ja) 電子回路モジュール
JPH0823163A (ja) 基板の実装方法
JPH0396292A (ja) 印刷配線板
JPH04134874U (ja) 面実装型混成集積回路モジユール
JPH0810192Y2 (ja) 半導体の実装構造
JPS635248Y2 (pt)
JPH0593073U (ja) プリント基板実装構造
JP2550879B2 (ja) 半導体装置の実装構造
JPH08222692A (ja) 複合形半導体装置およびその実装構造体並びにその実装方法
JP3671856B2 (ja) Ｌｓｉパッケージ構造
JP2697656B2 (ja) チップ部品立体実装用ソケット