JPH0812891B2 - 半田片付きダイオード用リードピンおよびその製造方法 - Google Patents

半田片付きダイオード用リードピンおよびその製造方法

Info

Publication number
JPH0812891B2
JPH0812891B2 JP4091766A JP9176692A JPH0812891B2 JP H0812891 B2 JPH0812891 B2 JP H0812891B2 JP 4091766 A JP4091766 A JP 4091766A JP 9176692 A JP9176692 A JP 9176692A JP H0812891 B2 JPH0812891 B2 JP H0812891B2
Authority
JP
Japan
Prior art keywords
solder
header
lead pin
solder piece
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4091766A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05267516A (ja
Inventor
秀雄 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Toyo Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kogyo Co Ltd filed Critical Toyo Kogyo Co Ltd
Priority to JP4091766A priority Critical patent/JPH0812891B2/ja
Priority to TW081109479A priority patent/TW234779B/zh
Priority to KR1019930001247A priority patent/KR970006530B1/ko
Publication of JPH05267516A publication Critical patent/JPH05267516A/ja
Publication of JPH0812891B2 publication Critical patent/JPH0812891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP4091766A 1992-03-17 1992-03-17 半田片付きダイオード用リードピンおよびその製造方法 Expired - Fee Related JPH0812891B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4091766A JPH0812891B2 (ja) 1992-03-17 1992-03-17 半田片付きダイオード用リードピンおよびその製造方法
TW081109479A TW234779B (cs) 1992-03-17 1992-11-26
KR1019930001247A KR970006530B1 (ko) 1992-03-17 1993-01-30 다이오우드용 리이드핀 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4091766A JPH0812891B2 (ja) 1992-03-17 1992-03-17 半田片付きダイオード用リードピンおよびその製造方法

Publications (2)

Publication Number Publication Date
JPH05267516A JPH05267516A (ja) 1993-10-15
JPH0812891B2 true JPH0812891B2 (ja) 1996-02-07

Family

ID=14035686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4091766A Expired - Fee Related JPH0812891B2 (ja) 1992-03-17 1992-03-17 半田片付きダイオード用リードピンおよびその製造方法

Country Status (3)

Country Link
JP (1) JPH0812891B2 (cs)
KR (1) KR970006530B1 (cs)
TW (1) TW234779B (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198479A (ja) * 2000-12-27 2002-07-12 Nippon Inter Electronics Corp アキシャルリード型半導体装置
US12555968B2 (en) 2020-06-30 2026-02-17 Mitsubishi Electric Corporation Terminal member, assembly, semiconductor device, and methods for manufacturing same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555721A (en) * 1978-06-27 1980-01-16 Kawasaki Steel Corp Detecting method for clogging of nozzle

Also Published As

Publication number Publication date
KR930020750A (ko) 1993-10-20
TW234779B (cs) 1994-11-21
KR970006530B1 (ko) 1997-04-29
JPH05267516A (ja) 1993-10-15

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