JPH08306838A - 電子部品用の接続リード - Google Patents

電子部品用の接続リード

Info

Publication number
JPH08306838A
JPH08306838A JP8132659A JP13265996A JPH08306838A JP H08306838 A JPH08306838 A JP H08306838A JP 8132659 A JP8132659 A JP 8132659A JP 13265996 A JP13265996 A JP 13265996A JP H08306838 A JPH08306838 A JP H08306838A
Authority
JP
Japan
Prior art keywords
electronic component
hardening
lead
connection lead
conductive alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8132659A
Other languages
English (en)
Japanese (ja)
Inventor
Ricardo Cozar
コザール リカルド
Jean-Pierre Reyal
レヤル ジャン−ピエール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Imphy SA
Original Assignee
Imphy SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imphy SA filed Critical Imphy SA
Publication of JPH08306838A publication Critical patent/JPH08306838A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Connection Of Batteries Or Terminals (AREA)
JP8132659A 1995-04-27 1996-04-30 電子部品用の接続リード Withdrawn JPH08306838A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9505015A FR2733630B1 (fr) 1995-04-27 1995-04-27 Pattes de connexion pour composant electronique
FR9505015 1995-04-27

Publications (1)

Publication Number Publication Date
JPH08306838A true JPH08306838A (ja) 1996-11-22

Family

ID=9478470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8132659A Withdrawn JPH08306838A (ja) 1995-04-27 1996-04-30 電子部品用の接続リード

Country Status (7)

Country Link
US (2) US5744868A (de)
EP (2) EP0740341A1 (de)
JP (1) JPH08306838A (de)
KR (1) KR960039229A (de)
CN (3) CN1140902A (de)
FR (1) FR2733630B1 (de)
RU (1) RU2159482C2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7831470B1 (en) * 1996-09-04 2010-11-09 Walker Digital, Llc Method and apparatus for facilitating electronic commerce through providing cross-benefits during a transaction
FR2733630B1 (fr) * 1995-04-27 1997-05-30 Imphy Sa Pattes de connexion pour composant electronique
US7162434B1 (en) * 1997-05-05 2007-01-09 Walker Digital, Llc Method and apparatus for facilitating the sale of subscriptions to periodicals
JP3334864B2 (ja) 1998-11-19 2002-10-15 松下電器産業株式会社 電子装置
DE60033772T2 (de) * 1999-12-24 2007-10-31 Hitachi Metals, Ltd. Martensitaushärtender Stahl mit hoher Dauerfestigkeit und Band aus dem martensitaushärtenden Stahl
FR2816959B1 (fr) * 2000-11-17 2003-08-01 Imphy Ugine Precision Procede pour fabriquer une bande ou une piece decoupee dans une bande en acier maraging laminee a froid
US20080006937A1 (en) * 2006-06-23 2008-01-10 Texas Instruments Incorporated Solderability Improvement Method for Leaded Semiconductor Package
US9141346B2 (en) * 2011-05-12 2015-09-22 Google Inc. Layout management in a rapid application development tool
JP6166953B2 (ja) * 2012-06-06 2017-07-19 大同特殊鋼株式会社 マルエージング鋼
US10840005B2 (en) 2013-01-25 2020-11-17 Vishay Dale Electronics, Llc Low profile high current composite transformer
CN106756583A (zh) * 2015-11-25 2017-05-31 中国科学院金属研究所 一种超高强高韧马氏体时效钢及其制备方法和应用
US10998124B2 (en) 2016-05-06 2021-05-04 Vishay Dale Electronics, Llc Nested flat wound coils forming windings for transformers and inductors
KR102571361B1 (ko) 2016-08-31 2023-08-25 비쉐이 데일 일렉트로닉스, 엘엘씨 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터
US12567533B2 (en) 2020-03-03 2026-03-03 Vishay Dale Electronics, Llc Inductor with preformed termination and method and assembly for making the same
USD1034462S1 (en) 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3790372A (en) * 1972-05-04 1974-02-05 M Chaturvedi Co-ni-cr base austentic alloys precipitation strengthened by intermetallic compounds and carbides
JPS5348917A (en) * 1976-10-18 1978-05-02 Hitachi Ltd Print wire
JPS5893860A (ja) * 1981-11-30 1983-06-03 Nippon Telegr & Teleph Corp <Ntt> 高力高導電性銅合金の製造方法
JPS59129746A (ja) * 1983-01-18 1984-07-26 Mitsubishi Metal Corp エンジンバルブおよび同バルブシ−ト用Ｃｏ基合金
JPS59170244A (ja) * 1983-03-16 1984-09-26 Mitsubishi Heavy Ind Ltd 強靭無Ｃｏマルエ−ジング鋼
US4999336A (en) * 1983-12-13 1991-03-12 Scm Metal Products, Inc. Dispersion strengthened metal composites
JPS60238446A (ja) * 1984-05-11 1985-11-27 Hitachi Metals Ltd 耐食性の優れたｉｃリ−ドフレ−ム用合金
DE3638855A1 (de) * 1985-11-26 1987-05-27 United Technologies Corp Superlegierung auf nickelbasis
WO1988005254A1 (en) * 1987-01-12 1988-07-14 Olin Corporation Process for producing formable and high strength leadframes in semiconductor packages
DE3821896A1 (de) * 1988-06-25 1989-12-28 Castolin Sa Pulverfoermiger metallhaltiger werkstoff und verfahren dazu
JPH0625395B2 (ja) * 1989-06-26 1994-04-06 日立金属株式会社 高強度リードフレーム材料およびその製造方法
JPH03197641A (ja) * 1989-12-26 1991-08-29 Nippon Mining Co Ltd リードフレーム材
DE69119952T2 (de) * 1990-03-23 1997-01-02 Motorola Inc Oberflächenmontierbare Halbleitervorrichtung mit selbstbeladenen Lötverbindungen
US5246511A (en) * 1990-05-14 1993-09-21 Hitachi Metals, Ltd. High-strength lead frame material and method of producing same
JPH04231420A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd リードフレーム材の製造方法
MY107849A (en) * 1991-09-09 1996-06-29 Hitachi Cable Composite lead frame and method for manufacturing the same.
KR930006868A (ko) * 1991-09-11 1993-04-22 문정환 반도체 패키지
JP2797835B2 (ja) * 1992-05-01 1998-09-17 日本鋼管株式会社 耐食性、繰返し曲げ特性に優れた高強度Ｆｅ−Ｎｉ−Ｃｏ合金薄板およびその製造方法
JPH06172895A (ja) * 1992-12-03 1994-06-21 Yamaha Metanikusu Kk リードフレーム用銅合金
US5362679A (en) * 1993-07-26 1994-11-08 Vlsi Packaging Corporation Plastic package with solder grid array
JPH0748650A (ja) * 1993-08-05 1995-02-21 Hitachi Metals Ltd 高強度リードフレーム材料およびその製造方法
JP3042273B2 (ja) * 1993-08-09 2000-05-15 日本鋼管株式会社 耐銹性に優れたＩＣリードフレーム用Ｆｅ−Ｎｉ 系合金薄板の製造方法
FR2733630B1 (fr) * 1995-04-27 1997-05-30 Imphy Sa Pattes de connexion pour composant electronique

Also Published As

Publication number Publication date
FR2733630A1 (fr) 1996-10-31
EP0740341A1 (de) 1996-10-30
EP0991122A2 (de) 2000-04-05
CN1269605A (zh) 2000-10-11
RU2159482C2 (ru) 2000-11-20
FR2733630B1 (fr) 1997-05-30
EP0991122A3 (de) 2000-07-26
US5744868A (en) 1998-04-28
US5888848A (en) 1999-03-30
KR960039229A (ko) 1996-11-21
CN1140902A (zh) 1997-01-22
CN1269604A (zh) 2000-10-11

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20030701