JPH11214662A5 - - Google Patents

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Publication number
JPH11214662A5
JPH11214662A5 JP1998017014A JP1701498A JPH11214662A5 JP H11214662 A5 JPH11214662 A5 JP H11214662A5 JP 1998017014 A JP1998017014 A JP 1998017014A JP 1701498 A JP1701498 A JP 1701498A JP H11214662 A5 JPH11214662 A5 JP H11214662A5
Authority
JP
Japan
Prior art keywords
region
transistors
gate
gate contact
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998017014A
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English (en)
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JPH11214662A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10017014A priority Critical patent/JPH11214662A/ja
Priority claimed from JP10017014A external-priority patent/JPH11214662A/ja
Priority to TW087110766A priority patent/TW393764B/zh
Priority to US09/126,092 priority patent/US6084255A/en
Priority to KR1019980034835A priority patent/KR19990066747A/ko
Publication of JPH11214662A publication Critical patent/JPH11214662A/ja
Publication of JPH11214662A5 publication Critical patent/JPH11214662A5/ja
Pending legal-status Critical Current

Links

Description

SOI層17には、その主面に沿って、PMOS領域RPとNMOS領域RNとが形成されている。これらの領域は、対称軸SAを境界として、その両側に対称に形成される。PMOS領域RPは、PMOSトランジスタが形成される領域であり、NMOS領域RNは、NMOSトランジスタが形成される領域である。すなわち、この装置101は、CMOSトランジスタを回路要素とする回路の形成に適した装置として構成されている。
また、ゲート絶縁膜13に対応してゲート絶縁膜14、ゲート電極3に対応してゲート電極4、ゲートコンタクト領域5,6に対応して、ゲートコンタクト領域7,8が形成されている。ゲートコンタクト領域9およびゲートコンタクト領域10は、それぞれボディ領域11およびボディ領域12の対称軸SAから遠い方の一端に連結している。
さらに、図4に示すように、ゲートコンタクト領域7(または5)どうし、および、ボディコンタクト領域10(または9)どうしは、分離絶縁膜23によって電気的に絶縁されている。図示を略するが、ゲートコンタクト領域8(または6)どうしも、分離絶縁膜23によって電気的に絶縁されている。これらの、分離絶縁膜22〜24は、いずれも、その上部は、SOI層17の上主面の上に露出するとともに、その底部は、絶縁層21の上主面に達している。これによって、分離絶縁膜22〜24は、それらの両側に分け隔てられたSOI層17の部分を互いに電気的に絶縁する。
さらに、トランジスタQ1,Q2に隣接するMOSトランジスタ、すなわち、これらのトランジスタを挟むトランジスタについては、ゲートコンタクト領域5およびボディコンタクト領域9は、ともに、コンタクトホールCHおよび配線パターンM1を通じて電源配線31へと接続されている。同様に、トランジスタQ3,Q4に隣接するMOSトランジスタ、すなわち、これらのトランジスタを挟むトランジスタについては、ゲートコンタクト領域7およびボディコンタクト領域10は、ともに、コンタクトホールCHおよび配線パターンM1を通じて電源配線32へと接続されている。

JP10017014A 1998-01-29 1998-01-29 半導体装置 Pending JPH11214662A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP10017014A JPH11214662A (ja) 1998-01-29 1998-01-29 半導体装置
TW087110766A TW393764B (en) 1998-01-29 1998-07-03 Semiconductor device
US09/126,092 US6084255A (en) 1998-01-29 1998-07-30 Gate array semiconductor device
KR1019980034835A KR19990066747A (ko) 1998-01-29 1998-08-27 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10017014A JPH11214662A (ja) 1998-01-29 1998-01-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH11214662A JPH11214662A (ja) 1999-08-06
JPH11214662A5 true JPH11214662A5 (ja) 2005-08-11

Family

ID=11932156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10017014A Pending JPH11214662A (ja) 1998-01-29 1998-01-29 半導体装置

Country Status (4)

Country Link
US (1) US6084255A (ja)
JP (1) JPH11214662A (ja)
KR (1) KR19990066747A (ja)
TW (1) TW393764B (ja)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6804502B2 (en) 2001-10-10 2004-10-12 Peregrine Semiconductor Corporation Switch circuit and method of switching radio frequency signals
JP3526450B2 (ja) 2001-10-29 2004-05-17 株式会社東芝 半導体集積回路およびスタンダードセル配置設計方法
US6677645B2 (en) 2002-01-31 2004-01-13 International Business Machines Corporation Body contact MOSFET
US7058796B2 (en) * 2002-05-20 2006-06-06 Airdefense, Inc. Method and system for actively defending a wireless LAN against attacks
WO2006002347A1 (en) 2004-06-23 2006-01-05 Peregrine Semiconductor Corporation Integrated rf front end
US7786662B2 (en) * 2005-05-19 2010-08-31 Texas Instruments Incorporated Display using a movable electron field emitter and method of manufacture thereof
US7910993B2 (en) 2005-07-11 2011-03-22 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFET's using an accumulated charge sink
US7890891B2 (en) 2005-07-11 2011-02-15 Peregrine Semiconductor Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
US8742502B2 (en) 2005-07-11 2014-06-03 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction
US9653601B2 (en) 2005-07-11 2017-05-16 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction
US20080076371A1 (en) 2005-07-11 2008-03-27 Alexander Dribinsky Circuit and method for controlling charge injection in radio frequency switches
USRE48965E1 (en) 2005-07-11 2022-03-08 Psemi Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
JP4845177B2 (ja) * 2005-07-15 2011-12-28 ラピスセミコンダクタ株式会社 半導体装置
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US7763534B2 (en) 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US7917879B2 (en) 2007-08-02 2011-03-29 Tela Innovations, Inc. Semiconductor device with dynamic array section
US8653857B2 (en) 2006-03-09 2014-02-18 Tela Innovations, Inc. Circuitry and layouts for XOR and XNOR logic
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US8541879B2 (en) 2007-12-13 2013-09-24 Tela Innovations, Inc. Super-self-aligned contacts and method for making the same
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US9230910B2 (en) 2006-03-09 2016-01-05 Tela Innovations, Inc. Oversized contacts and vias in layout defined by linearly constrained topology
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
JP5041760B2 (ja) * 2006-08-08 2012-10-03 ルネサスエレクトロニクス株式会社 半導体集積回路装置
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
EP2255443B1 (en) 2008-02-28 2012-11-28 Peregrine Semiconductor Corporation Method and apparatus for use in digitally tuning a capacitor in an integrated circuit device
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
KR101903975B1 (ko) 2008-07-16 2018-10-04 텔라 이노베이션스, 인코포레이티드 동적 어레이 아키텍쳐에서의 셀 페이징과 배치를 위한 방법 및 그 구현
US8723260B1 (en) 2009-03-12 2014-05-13 Rf Micro Devices, Inc. Semiconductor radio frequency switch with body contact
US8661392B2 (en) 2009-10-13 2014-02-25 Tela Innovations, Inc. Methods for cell boundary encroachment and layouts implementing the Same
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same
US8664746B2 (en) * 2011-09-20 2014-03-04 Stmicroelectronics Pte. Ltd. Gettering method for dielectrically isolated devices
US9590674B2 (en) 2012-12-14 2017-03-07 Peregrine Semiconductor Corporation Semiconductor devices with switchable ground-body connection
US20150236798A1 (en) 2013-03-14 2015-08-20 Peregrine Semiconductor Corporation Methods for Increasing RF Throughput Via Usage of Tunable Filters
US9406695B2 (en) 2013-11-20 2016-08-02 Peregrine Semiconductor Corporation Circuit and method for improving ESD tolerance and switching speed
US9748246B2 (en) 2014-11-06 2017-08-29 Samsung Electronics Co., Ltd. Semiconductor integrated circuits having contacts spaced apart from active regions
US9831857B2 (en) 2015-03-11 2017-11-28 Peregrine Semiconductor Corporation Power splitter with programmable output phase shift
US9583493B2 (en) 2015-04-08 2017-02-28 Samsung Electronics Co., Ltd. Integrated circuit and semiconductor device
KR102342851B1 (ko) 2015-08-17 2021-12-23 삼성전자주식회사 반도체 칩, 테스트 시스템 및 반도체 칩의 테스트 방법
US9948281B2 (en) 2016-09-02 2018-04-17 Peregrine Semiconductor Corporation Positive logic digitally tunable capacitor
JP6955566B2 (ja) * 2017-08-07 2021-10-27 タワー パートナーズ セミコンダクター株式会社 半導体装置
US10672885B2 (en) * 2017-10-19 2020-06-02 Newport Fab, Llc Silicide block isolation for reducing off-capacitance of a radio frequency (RF) switch
US10236872B1 (en) 2018-03-28 2019-03-19 Psemi Corporation AC coupling modules for bias ladders
US10886911B2 (en) 2018-03-28 2021-01-05 Psemi Corporation Stacked FET switch bias ladders
US10505530B2 (en) 2018-03-28 2019-12-10 Psemi Corporation Positive logic switch with selectable DC blocking circuit
JP7180359B2 (ja) * 2018-12-19 2022-11-30 富士電機株式会社 抵抗素子
US11476849B2 (en) 2020-01-06 2022-10-18 Psemi Corporation High power positive logic switch
JP7446446B2 (ja) * 2021-02-05 2024-03-08 チャンシン メモリー テクノロジーズ インコーポレイテッド スタンダードセルレイアウトテンプレート及び半導体構造
US11948931B2 (en) * 2021-02-05 2024-04-02 Micron Technology, Inc. Apparatuses including semiconductor layout to mitigate local layout effects

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001528A (en) * 1989-01-31 1991-03-19 The United States Of America As Represented By The Secretary Of The Air Force Radiation hardened CMOS on SOI or SOS devices
JPH07283377A (ja) * 1994-01-03 1995-10-27 Texas Instr Inc <Ti> 小型ゲートアレイおよびその製造方法
JPH0951083A (ja) * 1995-08-10 1997-02-18 Mitsubishi Electric Corp ゲートアレイ型半導体集積回路装置及びその製造方法
JP2798056B2 (ja) * 1996-05-30 1998-09-17 日本電気株式会社 マスタスライス半導体集積回路

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