JPS51139274A - Method of manufacturing semi_conductor device - Google Patents

Method of manufacturing semi_conductor device

Info

Publication number
JPS51139274A
JPS51139274A JP50062861A JP6286175A JPS51139274A JP S51139274 A JPS51139274 A JP S51139274A JP 50062861 A JP50062861 A JP 50062861A JP 6286175 A JP6286175 A JP 6286175A JP S51139274 A JPS51139274 A JP S51139274A
Authority
JP
Japan
Prior art keywords
conductor device
manufacturing semi
cmosic
semi
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50062861A
Other languages
Japanese (ja)
Inventor
Koichi Nagasawa
Takashi Azuma
Yasutake Kuki
Rei Meguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50062861A priority Critical patent/JPS51139274A/en
Publication of JPS51139274A publication Critical patent/JPS51139274A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To manufacture a CMOSIC with high precision and with flat surface for preventing breakage of the A1 wiring by making use of a selectively plasma-etched silicon nitride film as diffusion mask for forming the source and drain.
JP50062861A 1975-05-28 1975-05-28 Method of manufacturing semi_conductor device Pending JPS51139274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50062861A JPS51139274A (en) 1975-05-28 1975-05-28 Method of manufacturing semi_conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062861A JPS51139274A (en) 1975-05-28 1975-05-28 Method of manufacturing semi_conductor device

Publications (1)

Publication Number Publication Date
JPS51139274A true JPS51139274A (en) 1976-12-01

Family

ID=13212489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50062861A Pending JPS51139274A (en) 1975-05-28 1975-05-28 Method of manufacturing semi_conductor device

Country Status (1)

Country Link
JP (1) JPS51139274A (en)

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