JPS5219971A - Shaping of leads sealed in lsi chip etc. - Google Patents

Shaping of leads sealed in lsi chip etc.

Info

Publication number
JPS5219971A
JPS5219971A JP50096884A JP9688475A JPS5219971A JP S5219971 A JPS5219971 A JP S5219971A JP 50096884 A JP50096884 A JP 50096884A JP 9688475 A JP9688475 A JP 9688475A JP S5219971 A JPS5219971 A JP S5219971A
Authority
JP
Japan
Prior art keywords
shaping
lsi chip
chip etc
leads sealed
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50096884A
Other languages
Japanese (ja)
Inventor
Kosei Hirohata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP50096884A priority Critical patent/JPS5219971A/en
Publication of JPS5219971A publication Critical patent/JPS5219971A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To provide leads zigzaging or meandering inside chips in the vettical dire direction and to thus achieve enhancement of resin seal air tight characteristics and simplification of lead patterns.
COPYRIGHT: (C)1977,JPO&Japio
JP50096884A 1975-08-08 1975-08-08 Shaping of leads sealed in lsi chip etc. Pending JPS5219971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50096884A JPS5219971A (en) 1975-08-08 1975-08-08 Shaping of leads sealed in lsi chip etc.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50096884A JPS5219971A (en) 1975-08-08 1975-08-08 Shaping of leads sealed in lsi chip etc.

Publications (1)

Publication Number Publication Date
JPS5219971A true JPS5219971A (en) 1977-02-15

Family

ID=14176819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50096884A Pending JPS5219971A (en) 1975-08-08 1975-08-08 Shaping of leads sealed in lsi chip etc.

Country Status (1)

Country Link
JP (1) JPS5219971A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123046A (en) * 1983-12-07 1985-07-01 Toshiba Corp Semiconductor device
US5101263A (en) * 1988-05-20 1992-03-31 Hitachi, Ltd. Semiconductor device and method for manufacturing the same
US5518684A (en) * 1994-03-09 1996-05-21 National Semiconductor Corporation Method of making a molded lead frame
US5821615A (en) * 1995-12-06 1998-10-13 Lg Semicon Co., Ltd. Semiconductor chip package having clip-type outlead and fabrication method of same
US6262482B1 (en) * 1998-02-03 2001-07-17 Oki Electric Industry Co., Ltd. Semiconductor device
US6531769B2 (en) 1998-11-20 2003-03-11 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123046A (en) * 1983-12-07 1985-07-01 Toshiba Corp Semiconductor device
US5101263A (en) * 1988-05-20 1992-03-31 Hitachi, Ltd. Semiconductor device and method for manufacturing the same
US5518684A (en) * 1994-03-09 1996-05-21 National Semiconductor Corporation Method of making a molded lead frame
US6516516B1 (en) 1995-06-12 2003-02-11 Hyundai Electronics Industries Co., Ltd. Semiconductor chip package having clip-type outlead and fabrication method of same
US5821615A (en) * 1995-12-06 1998-10-13 Lg Semicon Co., Ltd. Semiconductor chip package having clip-type outlead and fabrication method of same
US6262482B1 (en) * 1998-02-03 2001-07-17 Oki Electric Industry Co., Ltd. Semiconductor device
US6531769B2 (en) 1998-11-20 2003-03-11 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit
US6939740B2 (en) 1998-11-20 2005-09-06 Oki Electric Industry Co., Ltd. Method of fabricating an encapsulated semiconductor device with partly exposed leads

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