JPS5565461A - Semiconductor switch - Google Patents
Semiconductor switchInfo
- Publication number
- JPS5565461A JPS5565461A JP13783578A JP13783578A JPS5565461A JP S5565461 A JPS5565461 A JP S5565461A JP 13783578 A JP13783578 A JP 13783578A JP 13783578 A JP13783578 A JP 13783578A JP S5565461 A JPS5565461 A JP S5565461A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- resistance
- poly
- resistor
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/131—Thyristors having built-in components
- H10D84/133—Thyristors having built-in components the built-in components being capacitors or resistors
Landscapes
- Thyristors (AREA)
- Thyristor Switches And Gates (AREA)
Abstract
PURPOSE:To improve gate sensitivity and dv/dt resistance, by using a poly-Si resistor having a negative or a small positive temperature coefficient between gate and cathode. CONSTITUTION:A pnpn element structure gate 8 and cathode 9 are connected by poly-Si 10, and by feeding transient current to resistor 10, erroneous ignition is prevented. When the resistance is excessively large, there is no effect. Since the temperature coefficient of poly-Si resistor can be controlled by varying the impurity concentration, the characteristics that are influenced by the resistance between gate and cathode, such as, dv/dt resistance, gate sensitivity, holding current, can be designed optimum over the entire range of temperatures. Further, it is, of course, possible to insert poly-Si between gate and anode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13783578A JPS5565461A (en) | 1978-11-10 | 1978-11-10 | Semiconductor switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13783578A JPS5565461A (en) | 1978-11-10 | 1978-11-10 | Semiconductor switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5565461A true JPS5565461A (en) | 1980-05-16 |
Family
ID=15207934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13783578A Pending JPS5565461A (en) | 1978-11-10 | 1978-11-10 | Semiconductor switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5565461A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857747A (en) * | 1981-09-30 | 1983-04-06 | Sharp Corp | Semiconductor device |
| JPS5857748A (en) * | 1981-09-30 | 1983-04-06 | Sharp Corp | Semiconductor device |
| JPS5969970A (en) * | 1982-10-15 | 1984-04-20 | Nec Home Electronics Ltd | semiconductor equipment |
| JPS6397251U (en) * | 1986-12-15 | 1988-06-23 | ||
| US5424563A (en) * | 1993-12-27 | 1995-06-13 | Harris Corporation | Apparatus and method for increasing breakdown voltage ruggedness in semiconductor devices |
-
1978
- 1978-11-10 JP JP13783578A patent/JPS5565461A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857747A (en) * | 1981-09-30 | 1983-04-06 | Sharp Corp | Semiconductor device |
| JPS5857748A (en) * | 1981-09-30 | 1983-04-06 | Sharp Corp | Semiconductor device |
| JPS5969970A (en) * | 1982-10-15 | 1984-04-20 | Nec Home Electronics Ltd | semiconductor equipment |
| JPS6397251U (en) * | 1986-12-15 | 1988-06-23 | ||
| US5424563A (en) * | 1993-12-27 | 1995-06-13 | Harris Corporation | Apparatus and method for increasing breakdown voltage ruggedness in semiconductor devices |
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