JPS558363A - Thermocompression bonding method - Google Patents

Thermocompression bonding method

Info

Publication number
JPS558363A
JPS558363A JP8131078A JP8131078A JPS558363A JP S558363 A JPS558363 A JP S558363A JP 8131078 A JP8131078 A JP 8131078A JP 8131078 A JP8131078 A JP 8131078A JP S558363 A JPS558363 A JP S558363A
Authority
JP
Japan
Prior art keywords
bonding
gold
sheet
terminal
thicknesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8131078A
Other languages
English (en)
Inventor
Hideo Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8131078A priority Critical patent/JPS558363A/ja
Publication of JPS558363A publication Critical patent/JPS558363A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP8131078A 1978-07-03 1978-07-03 Thermocompression bonding method Pending JPS558363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8131078A JPS558363A (en) 1978-07-03 1978-07-03 Thermocompression bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8131078A JPS558363A (en) 1978-07-03 1978-07-03 Thermocompression bonding method

Publications (1)

Publication Number Publication Date
JPS558363A true JPS558363A (en) 1980-01-21

Family

ID=13742817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8131078A Pending JPS558363A (en) 1978-07-03 1978-07-03 Thermocompression bonding method

Country Status (1)

Country Link
JP (1) JPS558363A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0891027A (ja) * 1995-10-03 1996-04-09 Hitachi Ltd 自動車運転支援装置
US20110131798A1 (en) * 2009-03-05 2011-06-09 Teledyne Scientific & Imaging, Llc Microfabricated inductors with through-wafer vias

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0891027A (ja) * 1995-10-03 1996-04-09 Hitachi Ltd 自動車運転支援装置
US20110131798A1 (en) * 2009-03-05 2011-06-09 Teledyne Scientific & Imaging, Llc Microfabricated inductors with through-wafer vias
US8826514B2 (en) * 2009-03-05 2014-09-09 Teledyne Scientific & Imaging, Llc Microfabricated inductors with through-wafer vias

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