JPS56126951A - Semicondutor device - Google Patents

Semicondutor device

Info

Publication number
JPS56126951A
JPS56126951A JP3037780A JP3037780A JPS56126951A JP S56126951 A JPS56126951 A JP S56126951A JP 3037780 A JP3037780 A JP 3037780A JP 3037780 A JP3037780 A JP 3037780A JP S56126951 A JPS56126951 A JP S56126951A
Authority
JP
Japan
Prior art keywords
base
internal
electrode
lead
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3037780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS637030B2 (mo
Inventor
Kanji Otsuka
Tamotsu Usami
Masao Sekihashi
Toshihiro Tsuboi
Takashi Araki
Masahiro Uesawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUKAN DENSHI KK
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
NITSUKAN DENSHI KK
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUKAN DENSHI KK, Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical NITSUKAN DENSHI KK
Priority to JP3037780A priority Critical patent/JPS56126951A/ja
Publication of JPS56126951A publication Critical patent/JPS56126951A/ja
Publication of JPS637030B2 publication Critical patent/JPS637030B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP3037780A 1980-03-12 1980-03-12 Semicondutor device Granted JPS56126951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3037780A JPS56126951A (en) 1980-03-12 1980-03-12 Semicondutor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3037780A JPS56126951A (en) 1980-03-12 1980-03-12 Semicondutor device

Publications (2)

Publication Number Publication Date
JPS56126951A true JPS56126951A (en) 1981-10-05
JPS637030B2 JPS637030B2 (mo) 1988-02-15

Family

ID=12302181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3037780A Granted JPS56126951A (en) 1980-03-12 1980-03-12 Semicondutor device

Country Status (1)

Country Link
JP (1) JPS56126951A (mo)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166746A (ja) * 1982-03-29 1983-10-01 Nec Corp 半導体装置
JPS5958851A (ja) * 1982-09-28 1984-04-04 Fujitsu Ltd 半導体装置
JPS6014458A (ja) * 1983-07-06 1985-01-25 Narumi China Corp 半導体装置用セラミツクパツケ−ジ
JPS6014457A (ja) * 1983-07-06 1985-01-25 Narumi China Corp 半導体装置用セラミツクパツケ−ジ
JPS60100453A (ja) * 1983-11-05 1985-06-04 Mitsubishi Electric Corp 半導体装置用パツケ−ジ
JPS60189954A (ja) * 1984-03-12 1985-09-27 Toshiba Corp 半導体装置
JPH03141662A (ja) * 1989-10-26 1991-06-17 Matsushita Electric Works Ltd セラミック配線回路板の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166746A (ja) * 1982-03-29 1983-10-01 Nec Corp 半導体装置
JPS5958851A (ja) * 1982-09-28 1984-04-04 Fujitsu Ltd 半導体装置
JPS6014458A (ja) * 1983-07-06 1985-01-25 Narumi China Corp 半導体装置用セラミツクパツケ−ジ
JPS6014457A (ja) * 1983-07-06 1985-01-25 Narumi China Corp 半導体装置用セラミツクパツケ−ジ
JPS60100453A (ja) * 1983-11-05 1985-06-04 Mitsubishi Electric Corp 半導体装置用パツケ−ジ
JPS60189954A (ja) * 1984-03-12 1985-09-27 Toshiba Corp 半導体装置
JPH03141662A (ja) * 1989-10-26 1991-06-17 Matsushita Electric Works Ltd セラミック配線回路板の製造方法

Also Published As

Publication number Publication date
JPS637030B2 (mo) 1988-02-15

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