JPS5662339A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5662339A
JPS5662339A JP13774979A JP13774979A JPS5662339A JP S5662339 A JPS5662339 A JP S5662339A JP 13774979 A JP13774979 A JP 13774979A JP 13774979 A JP13774979 A JP 13774979A JP S5662339 A JPS5662339 A JP S5662339A
Authority
JP
Japan
Prior art keywords
silicon
film
substrate
point metal
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13774979A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0147012B2 (2
Inventor
Toru Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP13774979A priority Critical patent/JPS5662339A/ja
Publication of JPS5662339A publication Critical patent/JPS5662339A/ja
Publication of JPH0147012B2 publication Critical patent/JPH0147012B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP13774979A 1979-10-26 1979-10-26 Production of semiconductor device Granted JPS5662339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13774979A JPS5662339A (en) 1979-10-26 1979-10-26 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13774979A JPS5662339A (en) 1979-10-26 1979-10-26 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5662339A true JPS5662339A (en) 1981-05-28
JPH0147012B2 JPH0147012B2 (2) 1989-10-12

Family

ID=15205925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13774979A Granted JPS5662339A (en) 1979-10-26 1979-10-26 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5662339A (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886761A (ja) * 1981-10-27 1983-05-24 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン バイポ−ラトランジスタ・フリツプフロツプ用のポリシリコン相互接続
JPS59220919A (ja) * 1983-05-31 1984-12-12 Toshiba Corp 半導体装置の製造方法
JPS6057974A (ja) * 1983-09-09 1985-04-03 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS63207179A (ja) * 1987-02-24 1988-08-26 Seikosha Co Ltd 半導体装置の製造方法
JPH0226021A (ja) * 1988-07-14 1990-01-29 Matsushita Electron Corp 多層配線の形成方法
JPH02292866A (ja) * 1989-05-02 1990-12-04 Nec Corp Ｍｉｓ型半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944797A (2) * 1972-06-19 1974-04-27
JPS5413283A (en) * 1977-06-30 1979-01-31 Ibm Method of forming metal silicide layer on substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944797A (2) * 1972-06-19 1974-04-27
JPS5413283A (en) * 1977-06-30 1979-01-31 Ibm Method of forming metal silicide layer on substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886761A (ja) * 1981-10-27 1983-05-24 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン バイポ−ラトランジスタ・フリツプフロツプ用のポリシリコン相互接続
JPS59220919A (ja) * 1983-05-31 1984-12-12 Toshiba Corp 半導体装置の製造方法
JPS6057974A (ja) * 1983-09-09 1985-04-03 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS63207179A (ja) * 1987-02-24 1988-08-26 Seikosha Co Ltd 半導体装置の製造方法
JPH0226021A (ja) * 1988-07-14 1990-01-29 Matsushita Electron Corp 多層配線の形成方法
JPH02292866A (ja) * 1989-05-02 1990-12-04 Nec Corp Ｍｉｓ型半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0147012B2 (2) 1989-10-12

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