JPS5662342A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5662342A
JPS5662342A JP13765979A JP13765979A JPS5662342A JP S5662342 A JPS5662342 A JP S5662342A JP 13765979 A JP13765979 A JP 13765979A JP 13765979 A JP13765979 A JP 13765979A JP S5662342 A JPS5662342 A JP S5662342A
Authority
JP
Japan
Prior art keywords
gold
lead frame
lower caps
plated layer
manner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13765979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222456B2 (2
Inventor
Hiromichi Suzuki
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13765979A priority Critical patent/JPS5662342A/ja
Publication of JPS5662342A publication Critical patent/JPS5662342A/ja
Publication of JPS6222456B2 publication Critical patent/JPS6222456B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP13765979A 1979-10-26 1979-10-26 Semiconductor device Granted JPS5662342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13765979A JPS5662342A (en) 1979-10-26 1979-10-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13765979A JPS5662342A (en) 1979-10-26 1979-10-26 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5662342A true JPS5662342A (en) 1981-05-28
JPS6222456B2 JPS6222456B2 (2) 1987-05-18

Family

ID=15203804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13765979A Granted JPS5662342A (en) 1979-10-26 1979-10-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5662342A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141742A (ja) * 1985-12-17 1987-06-25 Fujitsu Ltd 半導体装置のパツケ−ジ
US5408126A (en) * 1993-12-17 1995-04-18 At&T Corp. Manufacture of semiconductor devices and novel lead frame assembly
US7145254B2 (en) * 2001-07-26 2006-12-05 Denso Corporation Transfer-molded power device and method for manufacturing transfer-molded power device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62141742A (ja) * 1985-12-17 1987-06-25 Fujitsu Ltd 半導体装置のパツケ−ジ
US5408126A (en) * 1993-12-17 1995-04-18 At&T Corp. Manufacture of semiconductor devices and novel lead frame assembly
US7145254B2 (en) * 2001-07-26 2006-12-05 Denso Corporation Transfer-molded power device and method for manufacturing transfer-molded power device

Also Published As

Publication number Publication date
JPS6222456B2 (2) 1987-05-18

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