JPS574156A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS574156A JPS574156A JP7799180A JP7799180A JPS574156A JP S574156 A JPS574156 A JP S574156A JP 7799180 A JP7799180 A JP 7799180A JP 7799180 A JP7799180 A JP 7799180A JP S574156 A JPS574156 A JP S574156A
- Authority
- JP
- Japan
- Prior art keywords
- electric pole
- layer
- semiconductor device
- film
- pole pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To provide a stable characteristic and improve a reliability of the semiconductor device by a method an electric pole pattern of connection electric pole layer for forming a multilayer electric pole structure is made as an electrode structure smaller than an electric pole pattern in a lower barrier metallic layer. CONSTITUTION:Insulative film 2 is selectively removed, open holes are provided in the base area 3 and the emitter area 4 so as to form a platinum silicide layer 5. Then, a thin titanium film 6 is formed and a platinum thin film 7 in the barrier layer is formed under a spattering by a photo-resist method. Then, a masking is performed by the photo-resist method so as to form a metalic thin film 8 for a connection electric pole. In this case, as an electric pole pattern 8, a mask smaller than the electric pole pattern 7 is applied. Thereby, a semiconductor device having a high reliability may be made, metal piece and metal burrs being not contacted with other electric poles caused by heat and shock during a mounting and a bonding operation, and some metallic materials being not floated in the insulative film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7799180A JPS574156A (en) | 1980-06-10 | 1980-06-10 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7799180A JPS574156A (en) | 1980-06-10 | 1980-06-10 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS574156A true JPS574156A (en) | 1982-01-09 |
Family
ID=13649284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7799180A Pending JPS574156A (en) | 1980-06-10 | 1980-06-10 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS574156A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0191467A (en) * | 1987-10-02 | 1989-04-11 | Asahi Glass Co Ltd | Thin film transistor substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117550A (en) * | 1976-03-30 | 1977-10-03 | Sony Corp | Electrode formation method |
-
1980
- 1980-06-10 JP JP7799180A patent/JPS574156A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117550A (en) * | 1976-03-30 | 1977-10-03 | Sony Corp | Electrode formation method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0191467A (en) * | 1987-10-02 | 1989-04-11 | Asahi Glass Co Ltd | Thin film transistor substrate |
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