JPS5758055B2 - - Google Patents

Info

Publication number
JPS5758055B2
JPS5758055B2 JP10281478A JP10281478A JPS5758055B2 JP S5758055 B2 JPS5758055 B2 JP S5758055B2 JP 10281478 A JP10281478 A JP 10281478A JP 10281478 A JP10281478 A JP 10281478A JP S5758055 B2 JPS5758055 B2 JP S5758055B2
Authority
JP
Japan
Prior art keywords
seat
auto
bonding
bonder
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10281478A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5530810A (en
Inventor
Tatsuo Hatanaka
Kyohei Tamaki
Tetsuo Nanbu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10281478A priority Critical patent/JPS5530810A/ja
Priority to US06/069,286 priority patent/US4301958A/en
Publication of JPS5530810A publication Critical patent/JPS5530810A/ja
Publication of JPS5758055B2 publication Critical patent/JPS5758055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Attitude Control For Articles On Conveyors (AREA)
JP10281478A 1978-08-24 1978-08-25 Automatic bonding system for semiconductor device assembling Granted JPS5530810A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10281478A JPS5530810A (en) 1978-08-25 1978-08-25 Automatic bonding system for semiconductor device assembling
US06/069,286 US4301958A (en) 1978-08-24 1979-08-24 Arrangement for automatically fabricating and bonding semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10281478A JPS5530810A (en) 1978-08-25 1978-08-25 Automatic bonding system for semiconductor device assembling

Publications (2)

Publication Number Publication Date
JPS5530810A JPS5530810A (en) 1980-03-04
JPS5758055B2 true JPS5758055B2 (mo) 1982-12-08

Family

ID=14337494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10281478A Granted JPS5530810A (en) 1978-08-24 1978-08-25 Automatic bonding system for semiconductor device assembling

Country Status (1)

Country Link
JP (1) JPS5530810A (mo)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166238A (ja) * 1986-12-27 1988-07-09 Shinkawa Ltd インナ−リ−ドボンデイング装置
JP7181217B2 (ja) * 2017-04-04 2022-11-30 クリック アンド ソッファ インダストリーズ、インク． 超音波溶接システムおよびその使用方法
CN110482153B (zh) * 2019-08-07 2024-04-12 四川大学 一种铅锭自动搬运装置
CN112193755B (zh) * 2020-09-22 2024-08-20 淮北矿业股份有限公司 一种实现多跨皮带采样煤流集中集料输送的装置及其方法

Also Published As

Publication number Publication date
JPS5530810A (en) 1980-03-04

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