JPS5775453A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS5775453A
JPS5775453A JP55151557A JP15155780A JPS5775453A JP S5775453 A JPS5775453 A JP S5775453A JP 55151557 A JP55151557 A JP 55151557A JP 15155780 A JP15155780 A JP 15155780A JP S5775453 A JPS5775453 A JP S5775453A
Authority
JP
Japan
Prior art keywords
layer
windows
film
type
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55151557A
Other languages
English (en)
Inventor
Yoshinobu Monma
Tsuneo Funatsu
Atsushi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55151557A priority Critical patent/JPS5775453A/ja
Priority to US06/315,903 priority patent/US4497106A/en
Priority to EP81305120A priority patent/EP0052450B1/en
Priority to DE8181305120T priority patent/DE3171338D1/de
Publication of JPS5775453A publication Critical patent/JPS5775453A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4451—Semiconductor materials, e.g. polysilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0113—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0107—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H10D84/0109—Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H10P32/1414—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer being silicon, silicide or SIPOS, e.g. polysilicon or porous silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material

Landscapes

  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP55151557A 1980-10-29 1980-10-29 Semiconductor device and manufacture thereof Pending JPS5775453A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP55151557A JPS5775453A (en) 1980-10-29 1980-10-29 Semiconductor device and manufacture thereof
US06/315,903 US4497106A (en) 1980-10-29 1981-10-28 Semiconductor device and a method of manufacturing the same
EP81305120A EP0052450B1 (en) 1980-10-29 1981-10-29 Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes
DE8181305120T DE3171338D1 (en) 1980-10-29 1981-10-29 Method of manufacturing a semiconductor device with polycrystalline semiconductor cum metal electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55151557A JPS5775453A (en) 1980-10-29 1980-10-29 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS5775453A true JPS5775453A (en) 1982-05-12

Family

ID=15521122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55151557A Pending JPS5775453A (en) 1980-10-29 1980-10-29 Semiconductor device and manufacture thereof

Country Status (4)

Country Link
US (1) US4497106A (ja)
EP (1) EP0052450B1 (ja)
JP (1) JPS5775453A (ja)
DE (1) DE3171338D1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955052A (ja) * 1982-09-24 1984-03-29 Hitachi Ltd 半導体集積回路装置の製造方法
JPS5987850A (ja) * 1982-11-11 1984-05-21 Matsushita Electronics Corp 半導体装置
JPS59200457A (ja) * 1983-04-18 1984-11-13 アイテイ−テイ−・インダストリ−ズ・インコ−ポレ−テツド 集積された絶縁ゲ−ト電界効果トランジスタを有するモノリシツク集積回路の製造方法
JPS60158655A (ja) * 1984-01-27 1985-08-20 Rohm Co Ltd 半導体装置およびその製造方法
JPS60165751A (ja) * 1984-02-08 1985-08-28 Hitachi Ltd 半導体集積回路装置
JPS6428859A (en) * 1987-07-23 1989-01-31 Fujitsu Ltd Manufacture of semiconductor device
JPH04237160A (ja) * 1991-01-22 1992-08-25 Nec Corp バイポーラｃｍｏｓ複合型半導体装置

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8104862A (nl) * 1981-10-28 1983-05-16 Philips Nv Halfgeleiderinrichting, en werkwijze ter vervaardiging daarvan.
JPS58225663A (ja) * 1982-06-23 1983-12-27 Toshiba Corp 半導体装置の製造方法
DE3230077A1 (de) * 1982-08-12 1984-02-16 Siemens AG, 1000 Berlin und 8000 München Integrierte bipolar- und mos-transistoren enthaltende halbleiterschaltung auf einem chip und verfahren zu ihrer herstellung
JPS5931052A (ja) * 1982-08-13 1984-02-18 Hitachi Ltd 半導体集積回路装置の製造方法
JPS5994861A (ja) * 1982-11-24 1984-05-31 Hitachi Ltd 半導体集積回路装置及びその製造方法
GB2143083B (en) * 1983-07-06 1987-11-25 Standard Telephones Cables Ltd Semiconductor structures
JPS6057952A (ja) * 1983-09-09 1985-04-03 Toshiba Corp 半導体装置の製造方法
JPS6080267A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体集積回路装置の製造方法
US5280188A (en) * 1985-03-07 1994-01-18 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor integrated circuit device having at least one bipolar transistor and a plurality of MOS transistors
US5340762A (en) * 1985-04-01 1994-08-23 Fairchild Semiconductor Corporation Method of making small contactless RAM cell
US5100824A (en) * 1985-04-01 1992-03-31 National Semiconductor Corporation Method of making small contactless RAM cell
CA1258320A (en) * 1985-04-01 1989-08-08 Madhukar B. Vora Small contactless ram cell
JPS61287159A (ja) * 1985-06-13 1986-12-17 Oki Electric Ind Co Ltd Ｂｉ−ＣＭＯＳ半導体ＩＣ装置の製造方法
US5324982A (en) * 1985-09-25 1994-06-28 Hitachi, Ltd. Semiconductor memory device having bipolar transistor and structure to avoid soft error
US6740958B2 (en) 1985-09-25 2004-05-25 Renesas Technology Corp. Semiconductor memory device
NL8600770A (nl) * 1986-03-26 1987-10-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
JP2515745B2 (ja) * 1986-07-14 1996-07-10 株式会社日立製作所 半導体装置の製造方法
GB2193036B (en) * 1986-07-24 1990-05-02 Mitsubishi Electric Corp Method of fabricating a semiconductor integrated circuit device
DE3785162D1 (de) * 1986-11-18 1993-05-06 Siemens Ag Integrierte halbleiterschaltung mit als duennschichtstege auf den die aktiven transistorbereiche trennenden feldoxidbereichen angeordneten lastwiderstaende und verfahren zu ihrer herstellung.
US4980303A (en) * 1987-08-19 1990-12-25 Fujitsu Limited Manufacturing method of a Bi-MIS semiconductor device
KR900001062B1 (ko) * 1987-09-15 1990-02-26 강진구 반도체 바이 씨 모오스 장치의 제조방법
US5121185A (en) * 1987-10-09 1992-06-09 Hitachi, Ltd. Monolithic semiconductor IC device including blocks having different functions with different breakdown voltages
US4994887A (en) * 1987-11-13 1991-02-19 Texas Instruments Incorporated High voltage merged bipolar/CMOS technology
US5179031A (en) * 1988-01-19 1993-01-12 National Semiconductor Corporation Method of manufacturing a polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide
US5001081A (en) * 1988-01-19 1991-03-19 National Semiconductor Corp. Method of manufacturing a polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide
US5124817A (en) * 1988-01-19 1992-06-23 National Semiconductor Corporation Polysilicon emitter and a polysilicon gate using the same etch of polysilicon on a thin gate oxide
JPH01255264A (ja) * 1988-04-05 1989-10-12 Seiko Instr Inc 半導体装置の製造方法
GB8810973D0 (en) * 1988-05-10 1988-06-15 Stc Plc Improvements in integrated circuits
DE3914910C2 (de) * 1988-05-10 1999-11-25 Northern Telecom Ltd Verfahren zur Herstellung einer integrierten Schaltung
US5008208A (en) * 1988-12-07 1991-04-16 Honeywell Inc. Method of making planarized, self-aligned bipolar integrated circuits
JP2787921B2 (ja) * 1989-01-06 1998-08-20 三菱電機株式会社 絶縁ゲート型バイポーラトランジスタ
JP3024143B2 (ja) * 1989-06-19 2000-03-21 ソニー株式会社 半導体装置の製法
US4960726A (en) * 1989-10-19 1990-10-02 International Business Machines Corporation BiCMOS process
US5082796A (en) * 1990-07-24 1992-01-21 National Semiconductor Corporation Use of polysilicon layer for local interconnect in a CMOS or BiCMOS technology incorporating sidewall spacers
KR0138352B1 (ko) * 1993-12-17 1998-04-28 김광호 반도체 장치 및 그의 제조방법
US5454258A (en) * 1994-05-09 1995-10-03 Olin Corporation Broad range moisture analyzer and method
KR0161378B1 (ko) * 1994-06-13 1998-12-01 김광호 바이폴라 접합 트랜지스터 제조방법
US5556796A (en) * 1995-04-25 1996-09-17 Micrel, Inc. Self-alignment technique for forming junction isolation and wells
US5668037A (en) * 1995-10-06 1997-09-16 Micron Technology, Inc. Method of forming a resistor and integrated circuitry having a resistor construction
JP2865045B2 (ja) * 1996-02-28 1999-03-08 日本電気株式会社 半導体装置の製造方法
US5923078A (en) * 1996-07-11 1999-07-13 Micron Technology, Inc. Method of forming a resistor and integrated circuitry having a resistor construction
US6130137A (en) * 1997-10-20 2000-10-10 Micron Technology, Inc. Method of forming a resistor and integrated circuitry having a resistor construction

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51127682A (en) * 1975-04-30 1976-11-06 Fujitsu Ltd Manufacturing process of semiconductor device
JPS5921191B2 (ja) * 1975-06-14 1984-05-18 富士通株式会社 電界効果半導体装置の製造方法
US4120707A (en) * 1977-03-30 1978-10-17 Harris Corporation Process of fabricating junction isolated IGFET and bipolar transistor integrated circuit by diffusion
JPS5846863B2 (ja) * 1977-08-25 1983-10-19 松下電器産業株式会社 半導体集積回路装置
JPS5485680A (en) * 1977-12-21 1979-07-07 Toshiba Corp Semiconductor device and its manufacture

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955052A (ja) * 1982-09-24 1984-03-29 Hitachi Ltd 半導体集積回路装置の製造方法
DE3334337A1 (de) * 1982-09-24 1984-03-29 Hitachi, Ltd., Tokyo Verfahren zur herstellung einer integrierten halbleitereinrichtung
JPS5987850A (ja) * 1982-11-11 1984-05-21 Matsushita Electronics Corp 半導体装置
JPS59200457A (ja) * 1983-04-18 1984-11-13 アイテイ−テイ−・インダストリ−ズ・インコ−ポレ−テツド 集積された絶縁ゲ−ト電界効果トランジスタを有するモノリシツク集積回路の製造方法
JPS60158655A (ja) * 1984-01-27 1985-08-20 Rohm Co Ltd 半導体装置およびその製造方法
JPS60165751A (ja) * 1984-02-08 1985-08-28 Hitachi Ltd 半導体集積回路装置
JPS6428859A (en) * 1987-07-23 1989-01-31 Fujitsu Ltd Manufacture of semiconductor device
JPH04237160A (ja) * 1991-01-22 1992-08-25 Nec Corp バイポーラｃｍｏｓ複合型半導体装置

Also Published As

Publication number Publication date
US4497106A (en) 1985-02-05
EP0052450A1 (en) 1982-05-26
DE3171338D1 (en) 1985-08-14
EP0052450B1 (en) 1985-07-10

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