JPS5779634A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5779634A JPS5779634A JP55155203A JP15520380A JPS5779634A JP S5779634 A JPS5779634 A JP S5779634A JP 55155203 A JP55155203 A JP 55155203A JP 15520380 A JP15520380 A JP 15520380A JP S5779634 A JPS5779634 A JP S5779634A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- magnesia spinel
- spinel layer
- single crystal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
Landscapes
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
Abstract
PURPOSE:To reduce the area of an element isolation region of semiconductor device by a method wherein a concave and convex regions are formed in a magnesia spinel layer, and after a single crystal semiconductor layer is formed on the region thereof, the single crystal semiconductor layer is removed up to expose the magnesia spinel layer. CONSTITUTION:The magnesia spinel layer 10 is formed on a single crystal silicon substrate 2, the concave and convex regions 11, 12 are formed in the layer 10 mentioned above, and after the silicon epitaxial layer 13 is formed thereon, the silicon epitaxial layer 13 grown upwardly from the magnesia spinel layer 10 is polished by chemical polishing to expose the magnesia spinel layer 10, and source and drain regions 3, 4 and a gate 5 are formed in the magnesia spinel layer 10 thereof. Accordingly the element isolation region can be formed easily, and isolation breadth a of an intergrated circuit can be determined by the breadth of the magnesia spinel layer whose etching off is not performed when patterning is to be performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55155203A JPS5779634A (en) | 1980-11-06 | 1980-11-06 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55155203A JPS5779634A (en) | 1980-11-06 | 1980-11-06 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5779634A true JPS5779634A (en) | 1982-05-18 |
Family
ID=15600747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55155203A Pending JPS5779634A (en) | 1980-11-06 | 1980-11-06 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5779634A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444014A (en) * | 1994-12-16 | 1995-08-22 | Electronics And Telecommunications Research Institute | Method for fabricating semiconductor device |
| JPH08186165A (en) * | 1994-12-19 | 1996-07-16 | Korea Electron Telecommun | Method for manufacturing SOI substrate and method for manufacturing dipole transistor using the same |
-
1980
- 1980-11-06 JP JP55155203A patent/JPS5779634A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444014A (en) * | 1994-12-16 | 1995-08-22 | Electronics And Telecommunications Research Institute | Method for fabricating semiconductor device |
| JPH08186165A (en) * | 1994-12-19 | 1996-07-16 | Korea Electron Telecommun | Method for manufacturing SOI substrate and method for manufacturing dipole transistor using the same |
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