JPS58116720A - 非単結晶半導体層の単結晶化方法 - Google Patents
非単結晶半導体層の単結晶化方法Info
- Publication number
- JPS58116720A JPS58116720A JP56212105A JP21210581A JPS58116720A JP S58116720 A JPS58116720 A JP S58116720A JP 56212105 A JP56212105 A JP 56212105A JP 21210581 A JP21210581 A JP 21210581A JP S58116720 A JPS58116720 A JP S58116720A
- Authority
- JP
- Japan
- Prior art keywords
- scanning
- energy beam
- energy
- single crystal
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3238—Materials thereof being insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2905—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/3808—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/3818—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using particle beams
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/382—Scanning of a beam
Landscapes
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56212105A JPS58116720A (ja) | 1981-12-30 | 1981-12-30 | 非単結晶半導体層の単結晶化方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56212105A JPS58116720A (ja) | 1981-12-30 | 1981-12-30 | 非単結晶半導体層の単結晶化方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58116720A true JPS58116720A (ja) | 1983-07-12 |
| JPH0337729B2 JPH0337729B2 (2) | 1991-06-06 |
Family
ID=16616957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56212105A Granted JPS58116720A (ja) | 1981-12-30 | 1981-12-30 | 非単結晶半導体層の単結晶化方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116720A (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627114A (ja) * | 1985-07-03 | 1987-01-14 | Agency Of Ind Science & Technol | ビ−ムアニ−ル方法 |
| US5496768A (en) * | 1993-12-03 | 1996-03-05 | Casio Computer Co., Ltd. | Method of manufacturing polycrystalline silicon thin film |
-
1981
- 1981-12-30 JP JP56212105A patent/JPS58116720A/ja active Granted
Non-Patent Citations (1)
| Title |
|---|
| APPL.PHYS.LETT=1981 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627114A (ja) * | 1985-07-03 | 1987-01-14 | Agency Of Ind Science & Technol | ビ−ムアニ−ル方法 |
| US5496768A (en) * | 1993-12-03 | 1996-03-05 | Casio Computer Co., Ltd. | Method of manufacturing polycrystalline silicon thin film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337729B2 (2) | 1991-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5371381A (en) | Process for producing single crystal semiconductor layer and semiconductor device produced by said process | |
| US7709378B2 (en) | Method and apparatus for processing thin metal layers | |
| KR100285796B1 (ko) | 반도체 장치의 제조 방법 및 반도체 장치 | |
| JPS58116720A (ja) | 非単結晶半導体層の単結晶化方法 | |
| JPS5925215A (ja) | 半導体装置の製造方法 | |
| JPS6115319A (ja) | 半導体装置の製造方法 | |
| JPS6342417B2 (2) | ||
| JPS5892213A (ja) | 半導体単結晶膜の製造方法 | |
| JPH0236051B2 (2) | ||
| JPH0236050B2 (2) | ||
| JPH0722119B2 (ja) | ビ−ムアニ−ル方法 | |
| JPS5958821A (ja) | 半導体単結晶膜の製造方法 | |
| JPS60152020A (ja) | アニ−ル方法 | |
| JPH0235451B2 (2) | ||
| JPS59224114A (ja) | 単結晶半導体薄膜の製造方法 | |
| JPS63151015A (ja) | Soi基板の製造方法 | |
| JPS61201414A (ja) | シリコン単結晶層の製造方法 | |
| JPS60126814A (ja) | 半導体装置の製造方法 | |
| JPS6090898A (ja) | 単結晶シリコン膜形成法 | |
| JPH0793262B2 (ja) | 半導体結晶層の製造方法 | |
| JPS5837917A (ja) | 半導体装置の製造方法 | |
| JPH0137356B2 (2) | ||
| JPS5837916A (ja) | 半導体装置の製造方法 | |
| JPS6038809A (ja) | 半導体装置の製造方法 | |
| JPH0149003B2 (2) |