JPS58130267A - 無電解メツキ前処理方法 - Google Patents

無電解メツキ前処理方法

Info

Publication number: JPS58130267A
Authority: JP; Japan
Prior art keywords: plating; film; gold; pretreatment; substrate
Prior art date: 1982-01-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP57010367A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6157912B2 (2

Inventor

Yoshihiro Ono

大野　好弘

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Seiko Epson Corp

Suwa Seikosha KK

Original Assignee

Seiko Epson Corp

Suwa Seikosha KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-01-26

Filing date

1982-01-26

Publication date

1983-08-03

1982-01-26 Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp

1982-01-26 Priority to JP57010367A priority Critical patent/JPS58130267A/ja

1983-08-03 Publication of JPS58130267A publication Critical patent/JPS58130267A/ja

1986-12-09 Publication of JPS6157912B2 publication Critical patent/JPS6157912B2/ja

Status Granted legal-status Critical Current

Links

238000007772 electroless plating Methods 0.000 title description 4
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 11
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
229910052763 palladium Inorganic materials 0.000 claims description 5
238000000034 method Methods 0.000 claims description 4
230000004913 activation Effects 0.000 claims description 3
238000001816 cooling Methods 0.000 claims 1
XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 claims 1
238000007747 plating Methods 0.000 description 22
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
239000010931 gold Substances 0.000 description 15
229910052737 gold Inorganic materials 0.000 description 15
239000000758 substrate Substances 0.000 description 10
239000000243 solution Substances 0.000 description 9
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
238000000576 coating method Methods 0.000 description 5
238000005406 washing Methods 0.000 description 5
239000011248 coating agent Substances 0.000 description 4
150000002500 ions Chemical class 0.000 description 4
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
238000002203 pretreatment Methods 0.000 description 4
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
230000003213 activating effect Effects 0.000 description 3
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
229960002050 hydrofluoric acid Drugs 0.000 description 3
229910052759 nickel Inorganic materials 0.000 description 3
230000001235 sensitizing effect Effects 0.000 description 3
239000002253 acid Substances 0.000 description 2
238000005422 blasting Methods 0.000 description 2
238000004140 cleaning Methods 0.000 description 2
239000007788 liquid Substances 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
239000000047 product Substances 0.000 description 2
RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
238000005452 bending Methods 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000007654 immersion Methods 0.000 description 1
229910052744 lithium Inorganic materials 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
229910052705 radium Inorganic materials 0.000 description 1
HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000011780 sodium chloride Substances 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010936 titanium Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1896—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by electrochemical pretreatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Chemically Coating (AREA)
Other Surface Treatments For Metallic Materials (AREA)

JP57010367A 1982-01-26 1982-01-26 無電解メツキ前処理方法 Granted JPS58130267A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP57010367A JPS58130267A (ja)	1982-01-26	1982-01-26	無電解メツキ前処理方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP57010367A JPS58130267A (ja)	1982-01-26	1982-01-26	無電解メツキ前処理方法

Publications (2)

Publication Number	Publication Date
JPS58130267A true JPS58130267A (ja)	1983-08-03
JPS6157912B2 JPS6157912B2 (2)	1986-12-09

Family

ID=11748183

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP57010367A Granted JPS58130267A (ja)	1982-01-26	1982-01-26	無電解メツキ前処理方法

Country Status (1)

Country	Link
JP (1)	JPS58130267A (2)

1982
- 1982-01-26 JP JP57010367A patent/JPS58130267A/ja active Granted

Also Published As

Publication number	Publication date
JPS6157912B2 (2)	1986-12-09

Publication	Publication Date	Title
EP0393169B1 (en)	1992-09-16	Method for plating on titanium
US7704366B2 (en)	2010-04-27	Pretreatment of magnesium substrates for electroplating
US5464524A (en)	1995-11-07	Plating method for a nickel-titanium alloy member
US3726771A (en)	1973-04-10	Process for chemical nickel plating of aluminum and its alloys
DE3020371A1 (de)	1981-12-03	Verfahren zur vorbehandlung von edelstahl fuer deine direkte galvanische vergoldung
US4196061A (en)	1980-04-01	Direct nickel-plating of aluminum
JPS62124290A (ja)	1987-06-05	チタン表面へのメツキ方法
US6669997B2 (en)	2003-12-30	Acousto-immersion coating and process for magnesium and its alloy
JPS6372894A (ja)	1988-04-02	チタンなどの材料の被覆方法
JP2962496B2 (ja)	1999-10-12	マグネ基合金のめっき方法
JP3074369B2 (ja)	2000-08-07	金合金メッキ液
JPS6157912B2 (2)	1986-12-09
US3672976A (en)	1972-06-27	Copper immersion coating on aluminum
JP3071552B2 (ja)	2000-07-31	眼鏡枠部品、その製造方法及び眼鏡枠
JPH0715156B2 (ja)	1995-02-22	チタン及びチタン合金上のめつき方法
JPS5914100B2 (ja)	1984-04-03	高ニツケルクロム合金への無電解ニツケルメツキ法
JPH03243791A (ja)	1991-10-30	アルミニウムの表面処理方法およびめっき方法
JPS5881962A (ja)	1983-05-17	メツキ体
SU1696608A1 (ru)	1991-12-07	Способ подготовки поверхности алюминиевых сплавов к химическому никелированию
JP3321875B2 (ja)	2002-09-09	チタニウム及びチタニウム合金上への表面処理下地調整法
JP3131324B2 (ja)	2001-01-31	ステンレス鋼の被覆前処理方法
JPH0210877B2 (2)	1990-03-09
JPH04311575A (ja)	1992-11-04	マグネシウム合金への表面処理下地調整方法
JP2527342B2 (ja)	1996-08-21	装飾体およびその製造方法
JPS6263699A (ja)	1987-03-20	チタン系素材への貴金属メツキ方法