JPS58178543A - 電子回路用基体の製造方法 - Google Patents

電子回路用基体の製造方法

Info

Publication number
JPS58178543A
JPS58178543A JP57062097A JP6209782A JPS58178543A JP S58178543 A JPS58178543 A JP S58178543A JP 57062097 A JP57062097 A JP 57062097A JP 6209782 A JP6209782 A JP 6209782A JP S58178543 A JPS58178543 A JP S58178543A
Authority
JP
Japan
Prior art keywords
electronic circuit
pattern
leads
piece
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57062097A
Other languages
English (en)
Japanese (ja)
Other versions
JPS641059B2 (da
Inventor
Kuniharu Noda
野田 邦治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Priority to JP57062097A priority Critical patent/JPS58178543A/ja
Publication of JPS58178543A publication Critical patent/JPS58178543A/ja
Publication of JPS641059B2 publication Critical patent/JPS641059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/481Leadframes for devices being provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57062097A 1982-04-13 1982-04-13 電子回路用基体の製造方法 Granted JPS58178543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57062097A JPS58178543A (ja) 1982-04-13 1982-04-13 電子回路用基体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57062097A JPS58178543A (ja) 1982-04-13 1982-04-13 電子回路用基体の製造方法

Publications (2)

Publication Number Publication Date
JPS58178543A true JPS58178543A (ja) 1983-10-19
JPS641059B2 JPS641059B2 (da) 1989-01-10

Family

ID=13190202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57062097A Granted JPS58178543A (ja) 1982-04-13 1982-04-13 電子回路用基体の製造方法

Country Status (1)

Country Link
JP (1) JPS58178543A (da)

Also Published As

Publication number Publication date
JPS641059B2 (da) 1989-01-10

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