JPS587348U - 電気部品の組立体 - Google Patents

電気部品の組立体

Info

Publication number
JPS587348U
JPS587348U JP1982032218U JP3221882U JPS587348U JP S587348 U JPS587348 U JP S587348U JP 1982032218 U JP1982032218 U JP 1982032218U JP 3221882 U JP3221882 U JP 3221882U JP S587348 U JPS587348 U JP S587348U
Authority
JP
Japan
Prior art keywords
assembly
electrical parts
semiconductor element
substrate
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982032218U
Other languages
English (en)
Other versions
JPS615813Y2 (ja
Inventor
若松　栄吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982032218U priority Critical patent/JPS587348U/ja
Publication of JPS587348U publication Critical patent/JPS587348U/ja
Application granted granted Critical
Publication of JPS615813Y2 publication Critical patent/JPS615813Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａ、　Ｂ、　Ｃ，Ｄはそれぞれ従来の半導体装置
の断面図を示し、Ｅは電子部品を取り付けた状態を示す
断面図であり、第２図Ａは本考案の半導体装置の断面図
、Ｂは電子部品を取り付けた状態を示す断面図である。 １１．２１・・・・・・金属配線層、１２．２２・・・
・・・七゛ラミック基板、１３．２３・・・・・・半導
体素子、１４゜２４・・・・・・外部電極導出部、１５
．２５・・・・・・可撓細線、１６．２６・・・・・・
樹脂、２６′・・・・・・樹脂状接着剤、１７．２７・
・・・・・電子部品、２８・曲・蓋体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一　　　　複数の金属配線を有する基板であって該金属
    配線の一部が半導体素子との接続に供され、他の一部が
    該半導体素子以外への接続に供されるようになされた基
    板と、該基板の一部に固定され上記金属配線層の一部と
    電気的に接続した半導体素子と、上記素子を覆った樹脂
    層と、該樹脂層上に接着した蓋体とを備えたことを特徴
    とする半導体装置。
JP1982032218U 1982-03-08 1982-03-08 電気部品の組立体 Granted JPS587348U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982032218U JPS587348U (ja) 1982-03-08 1982-03-08 電気部品の組立体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982032218U JPS587348U (ja) 1982-03-08 1982-03-08 電気部品の組立体

Publications (2)

Publication Number Publication Date
JPS587348U true JPS587348U (ja) 1983-01-18
JPS615813Y2 JPS615813Y2 (ja) 1986-02-21

Family

ID=29829614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982032218U Granted JPS587348U (ja) 1982-03-08 1982-03-08 電気部品の組立体

Country Status (1)

Country Link
JP (1) JPS587348U (ja)

Also Published As

Publication number Publication date
JPS615813Y2 (ja) 1986-02-21

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