JPS5890748A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5890748A
JPS5890748A JP57076941A JP7694182A JPS5890748A JP S5890748 A JPS5890748 A JP S5890748A JP 57076941 A JP57076941 A JP 57076941A JP 7694182 A JP7694182 A JP 7694182A JP S5890748 A JPS5890748 A JP S5890748A
Authority
JP
Japan
Prior art keywords
brazing
brazing material
wall member
metal
stad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57076941A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236391B2 (2
Inventor
Shinzo Anazawa
穴沢　信造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57076941A priority Critical patent/JPS5890748A/ja
Publication of JPS5890748A publication Critical patent/JPS5890748A/ja
Publication of JPS6236391B2 publication Critical patent/JPS6236391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57076941A 1982-05-07 1982-05-07 半導体装置 Granted JPS5890748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57076941A JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57076941A JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49100939A Division JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Publications (2)

Publication Number Publication Date
JPS5890748A true JPS5890748A (ja) 1983-05-30
JPS6236391B2 JPS6236391B2 (2) 1987-08-06

Family

ID=13619764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57076941A Granted JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS5890748A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61107751A (ja) * 1984-10-30 1986-05-26 Nec Kansai Ltd 樹脂モ−ルド型半導体装置
US4618879A (en) * 1983-04-20 1986-10-21 Fujitsu Limited Semiconductor device having adjacent bonding wires extending at different angles

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128555A (2) * 1974-09-04 1976-03-10 Nippon Electric Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128555A (2) * 1974-09-04 1976-03-10 Nippon Electric Co

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618879A (en) * 1983-04-20 1986-10-21 Fujitsu Limited Semiconductor device having adjacent bonding wires extending at different angles
JPS61107751A (ja) * 1984-10-30 1986-05-26 Nec Kansai Ltd 樹脂モ−ルド型半導体装置

Also Published As

Publication number Publication date
JPS6236391B2 (2) 1987-08-06

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