JPS59119044U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59119044U
JPS59119044U JP1983013458U JP1345883U JPS59119044U JP S59119044 U JPS59119044 U JP S59119044U JP 1983013458 U JP1983013458 U JP 1983013458U JP 1345883 U JP1345883 U JP 1345883U JP S59119044 U JPS59119044 U JP S59119044U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor pellet
substrate
semiconductor
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983013458U
Other languages
English (en)
Inventor
孝志 八木
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1983013458U priority Critical patent/JPS59119044U/ja
Publication of JPS59119044U publication Critical patent/JPS59119044U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の一例を示す一部透視平面図
、第２図は第１図要部拡大平面図、第３図は本考案の一
実施例を示す一部透視平面図、第４図は第３図要部拡大
平面図、第５図は本考案の他の実施例を示す要部拡大平
面図である。 １・・・基板、７・・・半導体ペレット、８ａ・・・接
地電極、ｌｌｃ、　　ｇｃ’・・・電源供給電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数組の同一回路を有しかつ各同一回路の電源供給電極
    及び／又は接地電極を独立して形成した半導体ペレット
    を基板上に載置し、一端を半導体ペレットの近傍に配置
    した複数のリードと半導体ペレットの電極とをそれぞれ
    電気的に接続したことを特徴とする半導体装置。
JP1983013458U 1983-01-31 1983-01-31 半導体装置 Pending JPS59119044U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983013458U JPS59119044U (ja) 1983-01-31 1983-01-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983013458U JPS59119044U (ja) 1983-01-31 1983-01-31 半導体装置

Publications (1)

Publication Number Publication Date
JPS59119044U true JPS59119044U (ja) 1984-08-11

Family

ID=30144842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983013458U Pending JPS59119044U (ja) 1983-01-31 1983-01-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS59119044U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0851113A (ja) * 1994-08-05 1996-02-20 Sony Corp 半導体集積回路とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0851113A (ja) * 1994-08-05 1996-02-20 Sony Corp 半導体集積回路とその製造方法

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