JPS59126643A - 電子回路の被覆方法 - Google Patents

電子回路の被覆方法

Info

Publication number
JPS59126643A
JPS59126643A JP58001395A JP139583A JPS59126643A JP S59126643 A JPS59126643 A JP S59126643A JP 58001395 A JP58001395 A JP 58001395A JP 139583 A JP139583 A JP 139583A JP S59126643 A JPS59126643 A JP S59126643A
Authority
JP
Japan
Prior art keywords
electronic circuit
substrate
thermosetting resin
thermoplastic resin
damp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58001395A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6361774B2 (2
Inventor
Yoshio Nakatani
芳雄 中谷
Morinori Fukuda
守記 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58001395A priority Critical patent/JPS59126643A/ja
Publication of JPS59126643A publication Critical patent/JPS59126643A/ja
Publication of JPS6361774B2 publication Critical patent/JPS6361774B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58001395A 1983-01-07 1983-01-07 電子回路の被覆方法 Granted JPS59126643A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58001395A JPS59126643A (ja) 1983-01-07 1983-01-07 電子回路の被覆方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58001395A JPS59126643A (ja) 1983-01-07 1983-01-07 電子回路の被覆方法

Publications (2)

Publication Number Publication Date
JPS59126643A true JPS59126643A (ja) 1984-07-21
JPS6361774B2 JPS6361774B2 (2) 1988-11-30

Family

ID=11500298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58001395A Granted JPS59126643A (ja) 1983-01-07 1983-01-07 電子回路の被覆方法

Country Status (1)

Country Link
JP (1) JPS59126643A (2)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172171U (2) * 1986-04-23 1987-10-31
JPS63316462A (ja) * 1987-06-18 1988-12-23 Toshiba Corp 半導体モジュ−ル
JP2013009884A (ja) * 2011-06-30 2013-01-17 Panasonic Corp 機器の制御装置
WO2016159318A1 (ja) * 2015-03-31 2016-10-06 浜松ホトニクス株式会社 半導体装置の製造方法
JP2020194876A (ja) * 2019-05-28 2020-12-03 株式会社タムラ製作所 保護被膜を有する配線板の製造方法
JP2020194877A (ja) * 2019-05-28 2020-12-03 株式会社タムラ製作所 保護被膜を有する配線板の製造方法
DE112019006914T5 (de) 2019-02-25 2021-11-04 Mitsubishi Electric Corporation Platine, Halbleitervorrichtung, Leistungswandler und sich bewegendes Objekt

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172171U (2) * 1986-04-23 1987-10-31
JPS63316462A (ja) * 1987-06-18 1988-12-23 Toshiba Corp 半導体モジュ−ル
JP2013009884A (ja) * 2011-06-30 2013-01-17 Panasonic Corp 機器の制御装置
US10615220B2 (en) 2015-03-31 2020-04-07 Hamamatsu Photonics K.K. Semiconductor device and manufacturing method thereof
US10622402B2 (en) 2015-03-31 2020-04-14 Hamamatsu Photonics K.K. Semiconductor device
CN107360729A (zh) * 2015-03-31 2017-11-17 浜松光子学株式会社 半导体装置及其制造方法
JPWO2016159318A1 (ja) * 2015-03-31 2018-02-01 浜松ホトニクス株式会社 半導体装置の製造方法
JPWO2016159320A1 (ja) * 2015-03-31 2018-02-01 浜松ホトニクス株式会社 半導体装置及びその製造方法
US10141368B2 (en) 2015-03-31 2018-11-27 Hamamatsu Photonics K.K. Semiconductor device
US10403676B2 (en) 2015-03-31 2019-09-03 Hamamatsu Photonics K.K. Semiconductor device manufacturing method
WO2016159318A1 (ja) * 2015-03-31 2016-10-06 浜松ホトニクス株式会社 半導体装置の製造方法
US10622403B2 (en) 2015-03-31 2020-04-14 Hamamatsu Photonics K.K. Semiconductor device manufacturing method
WO2016159320A1 (ja) * 2015-03-31 2016-10-06 浜松ホトニクス株式会社 半導体装置及びその製造方法
CN107360729B (zh) * 2015-03-31 2020-08-14 浜松光子学株式会社 半导体装置及其制造方法
KR20230169471A (ko) * 2015-03-31 2023-12-15 하마마츠 포토닉스 가부시키가이샤 반도체 장치
DE112019006914T5 (de) 2019-02-25 2021-11-04 Mitsubishi Electric Corporation Platine, Halbleitervorrichtung, Leistungswandler und sich bewegendes Objekt
US20210378085A1 (en) * 2019-02-25 2021-12-02 Mitsubishi Electric Corporation Circuit board, semiconductor device, power converter, and moving object
US12075556B2 (en) 2019-02-25 2024-08-27 Mitsubishi Electric Corporation Circuit board, semiconductor device, power converter, and moving object
JP2020194877A (ja) * 2019-05-28 2020-12-03 株式会社タムラ製作所 保護被膜を有する配線板の製造方法
JP2020194876A (ja) * 2019-05-28 2020-12-03 株式会社タムラ製作所 保護被膜を有する配線板の製造方法

Also Published As

Publication number Publication date
JPS6361774B2 (2) 1988-11-30

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