JPH0373155B2 - - Google Patents

Info

Publication number: JPH0373155B2
Authority: JP; Japan
Prior art keywords: thermosetting resin; resin; electronic circuit; coating; viscosity
Prior art date: 1982-12-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP21660982A

Other languages

English (en)

Japanese (ja)

Other versions

JPS59106185A (ja

Inventor

Yoshio Nakatani

Morinori Fukuda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-12-09

Filing date

1982-12-09

Publication date

1991-11-20

1982-12-09 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1982-12-09 Priority to JP57216609A priority Critical patent/JPS59106185A/ja

1984-06-19 Publication of JPS59106185A publication Critical patent/JPS59106185A/ja

1991-11-20 Publication of JPH0373155B2 publication Critical patent/JPH0373155B2/ja

Status Granted legal-status Critical Current

Links

239000011347 resin Substances 0.000 claims description 38
229920005989 resin Polymers 0.000 claims description 38
229920001187 thermosetting polymer Polymers 0.000 claims description 22
238000000034 method Methods 0.000 claims description 14
230000009974 thixotropic effect Effects 0.000 claims description 14
239000000758 substrate Substances 0.000 claims description 13
230000002265 prevention Effects 0.000 claims description 8
238000010438 heat treatment Methods 0.000 claims 1
238000000576 coating method Methods 0.000 description 17
239000011248 coating agent Substances 0.000 description 15
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
239000003822 epoxy resin Substances 0.000 description 4
229920000647 polyepoxide Polymers 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
241000209094 Oryza Species 0.000 description 3
235000007164 Oryza sativa Nutrition 0.000 description 3
238000007598 dipping method Methods 0.000 description 3
239000007788 liquid Substances 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
235000009566 rice Nutrition 0.000 description 3
238000005406 washing Methods 0.000 description 3
239000004925 Acrylic resin Substances 0.000 description 2
229920000178 Acrylic resin Polymers 0.000 description 2
VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
239000005062 Polybutadiene Substances 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
238000005266 casting Methods 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
238000004891 communication Methods 0.000 description 2
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
238000007654 immersion Methods 0.000 description 2
229920002857 polybutadiene Polymers 0.000 description 2
230000035939 shock Effects 0.000 description 2
DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
150000004982 aromatic amines Chemical group 0.000 description 1
239000000440 bentonite Substances 0.000 description 1
229910000278 bentonite Inorganic materials 0.000 description 1
SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
229910000019 calcium carbonate Inorganic materials 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
125000002883 imidazolyl group Chemical group 0.000 description 1
239000002075 main ingredient Substances 0.000 description 1
230000007257 malfunction Effects 0.000 description 1
239000000463 material Substances 0.000 description 1
JYVLIDXNZAXMDK-UHFFFAOYSA-N methyl propyl carbinol Natural products CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 1
230000035515 penetration Effects 0.000 description 1
238000007639 printing Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
238000005507 spraying Methods 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Landscapes

Non-Metallic Protective Coatings For Printed Circuits (AREA)

JP57216609A 1982-12-09 1982-12-09 電子回路の被覆方法 Granted JPS59106185A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP57216609A JPS59106185A (ja)	1982-12-09	1982-12-09	電子回路の被覆方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP57216609A JPS59106185A (ja)	1982-12-09	1982-12-09	電子回路の被覆方法

Publications (2)

Publication Number	Publication Date
JPS59106185A JPS59106185A (ja)	1984-06-19
JPH0373155B2 true JPH0373155B2 (2)	1991-11-20

Family

ID=16691105

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP57216609A Granted JPS59106185A (ja)	1982-12-09	1982-12-09	電子回路の被覆方法

Country Status (1)

Country	Link
JP (1)	JPS59106185A (2)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0831674B2 (ja) *	1986-05-13	1996-03-27	ブラザー工業株式会社	フレキシブル回路基板の製造方法
JPS63316462A (ja) *	1987-06-18	1988-12-23	Toshiba Corp	半導体モジュ−ル
JPH0425092A (ja) *	1990-05-16	1992-01-28	Toyo Ink Mfg Co Ltd	印刷回路板の製造法
JP2641961B2 (ja) *	1990-05-16	1997-08-20	東洋インキ製造株式会社	印刷回路板の製造法
JP5464949B2 (ja) *	2009-09-15	2014-04-09	パナソニック株式会社	保護膜の形成方法および実装構造体、ならびに実装構造体のリペア方法
DE102014018277A1 (de) *	2014-12-12	2016-06-16	Tesat-Spacecom Gmbh & Co. Kg	Verfahren zum Hestellen einer Hochspannungsisolierung von elektrischen Komponenten

1982
- 1982-12-09 JP JP57216609A patent/JPS59106185A/ja active Granted

Also Published As

Publication number	Publication date
JPS59106185A (ja)	1984-06-19

Publication	Publication Date	Title
CN110177450A (zh)	2019-08-27	电磁波屏蔽膜的制造方法及由此方法制造的电磁波屏蔽膜
JPH0373155B2 (2)	1991-11-20
JPS6361774B2 (2)	1988-11-30
EP0917184A3 (en)	2000-10-18	Electronic coatings having low dielectric constant
US3515585A (en)	1970-06-02	Gelation coating method for electronic circuit panels
JPS6012789A (ja)	1985-01-23	電子部品実装基板の防水処理方法
JPS59161053A (ja)	1984-09-11	実装基板
JPH01120091A (ja)	1989-05-12	ハイブリッドｉｃ
DE50201239D1 (de)	2004-11-11	Verfahren zur herstellung von bauelementen für elektronische geräte
JP3174474B2 (ja)	2001-06-11	プリント配線板の製造方法
JPS6124258A (ja)	1986-02-01	電子部品の外装構造
JPS60126893A (ja)	1985-07-06	プリント基板の防水処理方法
JPS6190495A (ja)	1986-05-08	防湿電子回路配線板
JPS61118415A (ja)	1986-06-05	樹脂組成物
JPS62130595A (ja)	1987-06-12	電気回路装置の製造方法
JPS60124991A (ja)	1985-07-04	プリント基板における防水処理構造
JPH0713243Y2 (ja)	1995-03-29	フレキシブルプリント配線基板のカバーコート材
JPS60134498A (ja)	1985-07-17	電子部品の製造方法
JPH04233750A (ja)	1992-08-21	電子部品用封止材及びそれを用いた電子部品
JPH03173444A (ja)	1991-07-26	ハイブリツドｉｃの外装被覆方法
JPH01165195A (ja)	1989-06-29	ハイブリッドｉｃ
JPS60124990A (ja)	1985-07-04	プリント基板における防水処理構造
JPH06268357A (ja)	1994-09-22	防湿絶縁処理された実装回路板の製造法
JPH0312260A (ja)	1991-01-21	粉体塗装法
JPS5912040B2 (ja)	1984-03-19	金属芯プリント板製造法