JPS6361774B2 - - Google Patents

Info

Publication number
JPS6361774B2
JPS6361774B2 JP58001395A JP139583A JPS6361774B2 JP S6361774 B2 JPS6361774 B2 JP S6361774B2 JP 58001395 A JP58001395 A JP 58001395A JP 139583 A JP139583 A JP 139583A JP S6361774 B2 JPS6361774 B2 JP S6361774B2
Authority
JP
Japan
Prior art keywords
electronic circuit
moisture
resin
insulation
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58001395A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59126643A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58001395A priority Critical patent/JPS59126643A/ja
Publication of JPS59126643A publication Critical patent/JPS59126643A/ja
Publication of JPS6361774B2 publication Critical patent/JPS6361774B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58001395A 1983-01-07 1983-01-07 電子回路の被覆方法 Granted JPS59126643A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58001395A JPS59126643A (ja) 1983-01-07 1983-01-07 電子回路の被覆方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58001395A JPS59126643A (ja) 1983-01-07 1983-01-07 電子回路の被覆方法

Publications (2)

Publication Number Publication Date
JPS59126643A JPS59126643A (ja) 1984-07-21
JPS6361774B2 true JPS6361774B2 (2) 1988-11-30

Family

ID=11500298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58001395A Granted JPS59126643A (ja) 1983-01-07 1983-01-07 電子回路の被覆方法

Country Status (1)

Country Link
JP (1) JPS59126643A (2)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172171U (2) * 1986-04-23 1987-10-31
JPS63316462A (ja) * 1987-06-18 1988-12-23 Toshiba Corp 半導体モジュ−ル
JP2013009884A (ja) * 2011-06-30 2013-01-17 Panasonic Corp 機器の制御装置
EP3279927A4 (en) * 2015-03-31 2018-11-14 Hamamatsu Photonics K.K. Semiconductor device
JPWO2020174535A1 (ja) 2019-02-25 2021-09-13 三菱電機株式会社 回路基板、半導体装置、電力変換装置及び移動体
JP7220623B2 (ja) * 2019-05-28 2023-02-10 株式会社タムラ製作所 保護被膜を有する配線板の製造方法
JP7028828B2 (ja) * 2019-05-28 2022-03-02 株式会社タムラ製作所 保護被膜を有する配線板の製造方法

Also Published As

Publication number Publication date
JPS59126643A (ja) 1984-07-21

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