JPS5957437A - 酸化珪素膜の形成方法 - Google Patents
酸化珪素膜の形成方法Info
- Publication number
- JPS5957437A JPS5957437A JP57167515A JP16751582A JPS5957437A JP S5957437 A JPS5957437 A JP S5957437A JP 57167515 A JP57167515 A JP 57167515A JP 16751582 A JP16751582 A JP 16751582A JP S5957437 A JPS5957437 A JP S5957437A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- resin
- silicon oxide
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57167515A JPS5957437A (ja) | 1982-09-28 | 1982-09-28 | 酸化珪素膜の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57167515A JPS5957437A (ja) | 1982-09-28 | 1982-09-28 | 酸化珪素膜の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5957437A true JPS5957437A (ja) | 1984-04-03 |
| JPS6366418B2 JPS6366418B2 (2) | 1988-12-20 |
Family
ID=15851110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57167515A Granted JPS5957437A (ja) | 1982-09-28 | 1982-09-28 | 酸化珪素膜の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5957437A (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129153A (ja) * | 1984-07-20 | 1986-02-10 | Fujitsu Ltd | 凹凸基板の平坦化方法 |
| JPS6230335A (ja) * | 1985-07-31 | 1987-02-09 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS62219928A (ja) * | 1986-03-20 | 1987-09-28 | Fujitsu Ltd | 絶縁膜の形成方法 |
| US5874367A (en) * | 1992-07-04 | 1999-02-23 | Trikon Technologies Limited | Method of treating a semi-conductor wafer |
-
1982
- 1982-09-28 JP JP57167515A patent/JPS5957437A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129153A (ja) * | 1984-07-20 | 1986-02-10 | Fujitsu Ltd | 凹凸基板の平坦化方法 |
| JPS6230335A (ja) * | 1985-07-31 | 1987-02-09 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS62219928A (ja) * | 1986-03-20 | 1987-09-28 | Fujitsu Ltd | 絶縁膜の形成方法 |
| US5874367A (en) * | 1992-07-04 | 1999-02-23 | Trikon Technologies Limited | Method of treating a semi-conductor wafer |
| US6287989B1 (en) | 1992-07-04 | 2001-09-11 | Trikon Technologies Limited | Method of treating a semiconductor wafer in a chamber using hydrogen peroxide and silicon containing gas or vapor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6366418B2 (2) | 1988-12-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0517475B1 (en) | Process for coating a substrate with a silica precursor | |
| JPS59178749A (ja) | 配線構造体 | |
| JPS63107122A (ja) | 凹凸基板の平坦化方法 | |
| US6806161B2 (en) | Process for preparing insulating material having low dielectric constant | |
| JP4049775B2 (ja) | 有機シリケート重合体およびこれを含む絶縁膜 | |
| JPH10283843A (ja) | 電気絶縁性薄膜形成用組成物および電気絶縁性薄膜の形成方法 | |
| JPS6046826B2 (ja) | 半導体装置 | |
| TW442546B (en) | Method for producing low dielectric coatings from hydrogen silsequioxane resin | |
| JP2007111645A5 (2) | ||
| JPS5957437A (ja) | 酸化珪素膜の形成方法 | |
| TW439197B (en) | Electronic coating having low dielectric constant | |
| JPS60124943A (ja) | 酸化珪素膜の形成方法 | |
| JP3229419B2 (ja) | 酸化ケイ素膜の形成方法 | |
| US7091287B2 (en) | Nanopore forming material for forming insulating film for semiconductors and low dielectric insulating film comprising the same | |
| JP4324786B2 (ja) | 積層体およびその製造方法ならびに絶縁膜および半導体装置 | |
| JPH0551458A (ja) | 有機けい素重合体およびこれを用いる半導体装置の製造方法 | |
| JP2556131B2 (ja) | 層間絶縁膜の形成方法 | |
| JPH0578939B2 (2) | ||
| JPH02192729A (ja) | 絶縁層の製造方法 | |
| JPH0263057A (ja) | 感光性耐熱樹脂組成物と集積回路の製造方法 | |
| JPS63152673A (ja) | 耐熱樹脂組成物 | |
| JPS6113382B2 (2) | ||
| JPH01313942A (ja) | 半導体装置 | |
| JPS6372142A (ja) | 半導体装置の製造方法 | |
| JPS63120774A (ja) | 高純度SiO2薄膜形成法 |