JPS5958834A - ワイヤボンダ−用クランパ - Google Patents

ワイヤボンダ−用クランパ

Info

Publication number
JPS5958834A
JPS5958834A JP57169393A JP16939382A JPS5958834A JP S5958834 A JPS5958834 A JP S5958834A JP 57169393 A JP57169393 A JP 57169393A JP 16939382 A JP16939382 A JP 16939382A JP S5958834 A JPS5958834 A JP S5958834A
Authority
JP
Japan
Prior art keywords
wire
mat
air
housing
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57169393A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141024B2 (mo
Inventor
Hiroshi Ushiki
博 丑木
Motoaki Kadosawa
門沢　元昭
Takamichi Aoto
青砥　孝道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57169393A priority Critical patent/JPS5958834A/ja
Publication of JPS5958834A publication Critical patent/JPS5958834A/ja
Publication of JPH0141024B2 publication Critical patent/JPH0141024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP57169393A 1982-09-28 1982-09-28 ワイヤボンダ−用クランパ Granted JPS5958834A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57169393A JPS5958834A (ja) 1982-09-28 1982-09-28 ワイヤボンダ−用クランパ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57169393A JPS5958834A (ja) 1982-09-28 1982-09-28 ワイヤボンダ−用クランパ

Publications (2)

Publication Number Publication Date
JPS5958834A true JPS5958834A (ja) 1984-04-04
JPH0141024B2 JPH0141024B2 (mo) 1989-09-01

Family

ID=15885763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57169393A Granted JPS5958834A (ja) 1982-09-28 1982-09-28 ワイヤボンダ−用クランパ

Country Status (1)

Country Link
JP (1) JPS5958834A (mo)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112235U (ja) * 1984-06-25 1986-01-24 株式会社 新川 ワイヤボンデイング装置
JPH04214644A (ja) * 1990-12-12 1992-08-05 Nec Kyushu Ltd ワイヤーボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112235U (ja) * 1984-06-25 1986-01-24 株式会社 新川 ワイヤボンデイング装置
JPH04214644A (ja) * 1990-12-12 1992-08-05 Nec Kyushu Ltd ワイヤーボンディング装置

Also Published As

Publication number Publication date
JPH0141024B2 (mo) 1989-09-01

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