JPS60141148U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60141148U
JPS60141148U JP1984028474U JP2847484U JPS60141148U JP S60141148 U JPS60141148 U JP S60141148U JP 1984028474 U JP1984028474 U JP 1984028474U JP 2847484 U JP2847484 U JP 2847484U JP S60141148 U JPS60141148 U JP S60141148U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
external lead
led out
lead terminals
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984028474U
Other languages
English (en)
Inventor
山崎　豊明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1984028474U priority Critical patent/JPS60141148U/ja
Publication of JPS60141148U publication Critical patent/JPS60141148U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置を示し、ａはその断面図、ｂ
その上面図である。第２図は本考案−実施例による半導
体装置を示し、ａはその断面図、ｂはその上面図である
。 １、ｌａ、ｌｂ・・・・・・リードフレーム、２・・・
・・・半導体素子、３・・・・・・金属細線、４・・曲
封入樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 封止容器から複数の外部リード端子が導出された半導体
    装置において、外部リード端子をその導出方向に対して
    １つおきに反対方向に折り曲けたことを特徴とする半導
    体装置。
JP1984028474U 1984-02-29 1984-02-29 半導体装置 Pending JPS60141148U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984028474U JPS60141148U (ja) 1984-02-29 1984-02-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984028474U JPS60141148U (ja) 1984-02-29 1984-02-29 半導体装置

Publications (1)

Publication Number Publication Date
JPS60141148U true JPS60141148U (ja) 1985-09-18

Family

ID=30526379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984028474U Pending JPS60141148U (ja) 1984-02-29 1984-02-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS60141148U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03289162A (ja) * 1990-04-05 1991-12-19 Rohm Co Ltd 面実装型電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03289162A (ja) * 1990-04-05 1991-12-19 Rohm Co Ltd 面実装型電子部品

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