JPS60174252U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS60174252U
JPS60174252U JP1984062144U JP6214484U JPS60174252U JP S60174252 U JPS60174252 U JP S60174252U JP 1984062144 U JP1984062144 U JP 1984062144U JP 6214484 U JP6214484 U JP 6214484U JP S60174252 U JPS60174252 U JP S60174252U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat sink
power transistor
locking groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984062144U
Other languages
English (en)
Japanese (ja)
Other versions
JPH025539Y2 (mo
Inventor
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1984062144U priority Critical patent/JPS60174252U/ja
Publication of JPS60174252U publication Critical patent/JPS60174252U/ja
Application granted granted Critical
Publication of JPH025539Y2 publication Critical patent/JPH025539Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984062144U 1984-04-25 1984-04-25 混成集積回路 Granted JPS60174252U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984062144U JPS60174252U (ja) 1984-04-25 1984-04-25 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984062144U JPS60174252U (ja) 1984-04-25 1984-04-25 混成集積回路

Publications (2)

Publication Number Publication Date
JPS60174252U true JPS60174252U (ja) 1985-11-19
JPH025539Y2 JPH025539Y2 (mo) 1990-02-09

Family

ID=30591078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984062144U Granted JPS60174252U (ja) 1984-04-25 1984-04-25 混成集積回路

Country Status (1)

Country Link
JP (1) JPS60174252U (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008262990A (ja) * 2007-04-10 2008-10-30 ▲がい▼笛森光電股▲ふん▼有限公司 発光ダイオード封入構造、及びその製造方法。

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008262990A (ja) * 2007-04-10 2008-10-30 ▲がい▼笛森光電股▲ふん▼有限公司 発光ダイオード封入構造、及びその製造方法。

Also Published As

Publication number Publication date
JPH025539Y2 (mo) 1990-02-09

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