JPS60228678A - 高分子材料表面に対する金属被膜形成方法 - Google Patents

高分子材料表面に対する金属被膜形成方法

Info

Publication number
JPS60228678A
JPS60228678A JP59084745A JP8474584A JPS60228678A JP S60228678 A JPS60228678 A JP S60228678A JP 59084745 A JP59084745 A JP 59084745A JP 8474584 A JP8474584 A JP 8474584A JP S60228678 A JPS60228678 A JP S60228678A
Authority
JP
Japan
Prior art keywords
high molecular
coating
film
molecular material
nitrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59084745A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445585B2 (fr
Inventor
Tatsuo Hamaya
浜谷　健生
Tokuzo Kanbe
神戸　徳蔵
Yaozo Kumagai
熊谷　八百三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP59084745A priority Critical patent/JPS60228678A/ja
Publication of JPS60228678A publication Critical patent/JPS60228678A/ja
Publication of JPH0445585B2 publication Critical patent/JPH0445585B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP59084745A 1984-04-26 1984-04-26 高分子材料表面に対する金属被膜形成方法 Granted JPS60228678A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59084745A JPS60228678A (ja) 1984-04-26 1984-04-26 高分子材料表面に対する金属被膜形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59084745A JPS60228678A (ja) 1984-04-26 1984-04-26 高分子材料表面に対する金属被膜形成方法

Publications (2)

Publication Number Publication Date
JPS60228678A true JPS60228678A (ja) 1985-11-13
JPH0445585B2 JPH0445585B2 (fr) 1992-07-27

Family

ID=13839224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59084745A Granted JPS60228678A (ja) 1984-04-26 1984-04-26 高分子材料表面に対する金属被膜形成方法

Country Status (1)

Country Link
JP (1) JPS60228678A (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193881A (ja) * 1989-12-22 1991-08-23 Sankei Giken Kogyo Kk 無電解めっき方法
JPH05132784A (ja) * 1991-11-11 1993-05-28 Tokyo Rika Univ 塩化ビニル樹脂へのめつき法
EP0510711A3 (en) * 1991-04-25 1996-09-11 Jeffrey M Calvert Processes and compositions for electroless metallization
JP2006256031A (ja) * 2005-03-16 2006-09-28 Chisso Corp 無電解メッキ用基板、無電解メッキされたメッキ基板およびその製造方法
JP2007262495A (ja) * 2006-03-28 2007-10-11 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体およびその製造方法
JP2008189831A (ja) * 2007-02-06 2008-08-21 Ebara Udylite Kk 絶縁樹脂のコンディショニング方法およびその利用
JP2013124390A (ja) * 2011-12-14 2013-06-24 Toyota Motor Corp 無電解めっき処理方法および無電解めっき処理材
CN104342733A (zh) * 2014-10-28 2015-02-11 蚌埠富源电子科技有限责任公司 一种不锈钢基材玻璃封接元件镀镍方法
JP2015190056A (ja) * 2014-03-31 2015-11-02 株式会社サーテックカリヤ 無電解めっき方法および無電解めっき物
CN110656326A (zh) * 2019-09-19 2020-01-07 山东非金属材料研究所 一种聚偏氟乙烯压电薄膜表面电极制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50154375A (fr) * 1974-06-04 1975-12-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50154375A (fr) * 1974-06-04 1975-12-12

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03193881A (ja) * 1989-12-22 1991-08-23 Sankei Giken Kogyo Kk 無電解めっき方法
EP0510711A3 (en) * 1991-04-25 1996-09-11 Jeffrey M Calvert Processes and compositions for electroless metallization
JPH05132784A (ja) * 1991-11-11 1993-05-28 Tokyo Rika Univ 塩化ビニル樹脂へのめつき法
JP2006256031A (ja) * 2005-03-16 2006-09-28 Chisso Corp 無電解メッキ用基板、無電解メッキされたメッキ基板およびその製造方法
JP2007262495A (ja) * 2006-03-28 2007-10-11 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体およびその製造方法
KR101305574B1 (ko) * 2006-03-28 2013-09-09 니폰 가가쿠 고교 가부시키가이샤 도전성 무전해 도금 분체 및 그의 제조 방법
JP2008189831A (ja) * 2007-02-06 2008-08-21 Ebara Udylite Kk 絶縁樹脂のコンディショニング方法およびその利用
JP2013124390A (ja) * 2011-12-14 2013-06-24 Toyota Motor Corp 無電解めっき処理方法および無電解めっき処理材
JP2015190056A (ja) * 2014-03-31 2015-11-02 株式会社サーテックカリヤ 無電解めっき方法および無電解めっき物
CN104342733A (zh) * 2014-10-28 2015-02-11 蚌埠富源电子科技有限责任公司 一种不锈钢基材玻璃封接元件镀镍方法
CN110656326A (zh) * 2019-09-19 2020-01-07 山东非金属材料研究所 一种聚偏氟乙烯压电薄膜表面电极制备方法

Also Published As

Publication number Publication date
JPH0445585B2 (fr) 1992-07-27

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