JPS61124151U - - Google Patents
Info
- Publication number
- JPS61124151U JPS61124151U JP1985006377U JP637785U JPS61124151U JP S61124151 U JPS61124151 U JP S61124151U JP 1985006377 U JP1985006377 U JP 1985006377U JP 637785 U JP637785 U JP 637785U JP S61124151 U JPS61124151 U JP S61124151U
- Authority
- JP
- Japan
- Prior art keywords
- driver
- signal input
- circuit
- wiring
- control signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Description
第１図、第２図は本考案のドライバＩＣ搭載型
サーマルヘツドの実施例１，２の要部を示す平面
図、第３図は本考案の応用例を示す平面図、第４
図、第５図は従来の制御信号入力配線のパターン
を示す平面図である。
１…抵抗体基板、２…発熱抵抗体、３…共通電
極配線、４…個別電極配線、５…ドライバＩＣ、
６…ボンデイングパツド、７…制御信号入力配線
、８…グランドライン、９…ボンデイングワイヤ
、１０…出力端子、１１，１２…制御信号入力端
子。
1 and 2 are plan views showing main parts of embodiments 1 and 2 of the driver IC-equipped thermal head of the present invention, FIG. 3 is a plan view showing an application example of the present invention, and FIG.
5 are plan views showing patterns of conventional control signal input wiring. DESCRIPTION OF SYMBOLS 1...Resistor board, 2...Heating resistor, 3...Common electrode wiring, 4...Individual electrode wiring, 5...Driver IC,
6... Bonding pad, 7... Control signal input wiring, 8... Ground line, 9... Bonding wire, 10... Output terminal, 11, 12... Control signal input terminal.
Claims (1)
レル出力に変換する信号変換回路、前記複数ビツ
トの出力タイミング制御回路、ドライバ回路を含
むドライバＩＣを搭載したサーマルヘツドにおい
て、ドライバＩＣとしてＩＣの一辺にドライバ出
力端子を配置し、その対向する一辺に制御信号入
力端子を配置したＩＣを使用し、このＩＣを発熱
抵抗体、前記発熱抵抗体への通電のための回路配
線および制御信号入力用配線を有し、かつ制御信
号入力用配線が、複数個のＩＣ単位で分割された
単層パターンにて形成された抵抗体基板に取り付
け、ボンデイングワイヤにて接続したことを特徴
とするドライバＩＣ搭載型サーマルヘツドの実装
構造。 (2) 複数ビツトのシリアル画像信号入力をパラ
レル出力に変換する信号変換回路、前記複数ビツ
トの出力タイミング制御回路、ドライバ回路を含
むドライバＩＣを搭載したりサーマルヘツドにお
いて、ドライバーＩＣとしてＩＣの一辺にドライ
バ出力端子を配置し、その対向する一辺に制御信
号入力端子を配置したＩＣを使用し、このＩＣを
発熱抵抗体、前記発熱抵抗体への通電のための回
路配線および制御信号入力用配線を有し、かつ制
御信号入力用配線が、ドライバ回路のグランドラ
インのみ全ＩＣ共通で、他の配線は複数個のＩＣ
単位で分割された単層パターンに形成された抵抗
体基板に取り付け、ボンデイングワイヤにて接続
したことを特徴とする実用新案登録請求の範囲第
１項記載のドライバーＩＣ搭載型サーマルヘツド
の実装構造。[Claims for Utility Model Registration] (1) A thermal head equipped with a driver IC including a signal conversion circuit that converts a multi-bit serial image signal input into a parallel output, an output timing control circuit for the plural bits, and a driver circuit, An IC in which a driver output terminal is arranged on one side of the IC and a control signal input terminal is arranged on the opposite side is used as a driver IC, and this IC is used as a heating resistor and circuit wiring for supplying electricity to the heating resistor. and control signal input wiring, and the control signal input wiring is attached to a resistor board formed of a single layer pattern divided into multiple IC units, and connected with bonding wire. This is a mounting structure of a thermal head equipped with a driver IC. (2) In a thermal head, a driver IC including a signal conversion circuit that converts a multi-bit serial image signal input into parallel output, a multi-bit output timing control circuit, and a driver circuit is installed, or a thermal head is installed on one side of the IC as a driver IC. An IC is used in which a driver output terminal is arranged and a control signal input terminal is arranged on one side facing the IC, and this IC is connected to a heat generating resistor, circuit wiring for energizing the heat generating resistor, and control signal input wiring. The control signal input wiring is common to all ICs except for the ground line of the driver circuit, and other wiring is connected to multiple ICs.
The mounting structure of a driver IC-mounted thermal head according to claim 1, which is attached to a resistor substrate formed in a single-layer pattern divided into units and connected with a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985006377U JPH0323734Y2 (en) | 1985-01-21 | 1985-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985006377U JPH0323734Y2 (en) | 1985-01-21 | 1985-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61124151U true JPS61124151U (en) | 1986-08-05 |
| JPH0323734Y2 JPH0323734Y2 (en) | 1991-05-23 |
Family
ID=30483763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985006377U Expired JPH0323734Y2 (en) | 1985-01-21 | 1985-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323734Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636846U (en) * | 1992-10-27 | 1994-05-17 | グラフテック株式会社 | Thermal head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5978867A (en) * | 1982-10-29 | 1984-05-07 | Toshiba Corp | Direct drive type thermal head |
-
1985
- 1985-01-21 JP JP1985006377U patent/JPH0323734Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5978867A (en) * | 1982-10-29 | 1984-05-07 | Toshiba Corp | Direct drive type thermal head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636846U (en) * | 1992-10-27 | 1994-05-17 | グラフテック株式会社 | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0323734Y2 (en) | 1991-05-23 |
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