JPS61153348U - - Google Patents
Info
- Publication number
- JPS61153348U JPS61153348U JP1985037316U JP3731685U JPS61153348U JP S61153348 U JPS61153348 U JP S61153348U JP 1985037316 U JP1985037316 U JP 1985037316U JP 3731685 U JP3731685 U JP 3731685U JP S61153348 U JPS61153348 U JP S61153348U
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- heat sink
- resin
- semiconductor device
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１，２図は本考案の実施例による半導体装置
の断面図、第３，４図は従来の半導体装置の断面
図である。 １……封止樹脂、２……放熱板、２ａ……放熱
板の封止樹脂に接する面、２ｂ……逆台形状の溝
、２ｃ……溝の斜面部、２ｄ……角状の溝、３…
…半導体素子、４……すき間。
の断面図、第３，４図は従来の半導体装置の断面
図である。 １……封止樹脂、２……放熱板、２ａ……放熱
板の封止樹脂に接する面、２ｂ……逆台形状の溝
、２ｃ……溝の斜面部、２ｄ……角状の溝、３…
…半導体素子、４……すき間。
Claims (1)
- 半導体素子を固着した放熱板の表面を封止樹脂
がおおう樹脂封止型半導体装置において、前記封
止樹脂と接する放熱板の表面に逆台形上の溝をも
うけた事を特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037316U JPS61153348U (ja) | 1985-03-15 | 1985-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037316U JPS61153348U (ja) | 1985-03-15 | 1985-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153348U true JPS61153348U (ja) | 1986-09-22 |
Family
ID=30543289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985037316U Pending JPS61153348U (ja) | 1985-03-15 | 1985-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153348U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07130915A (ja) * | 1993-11-04 | 1995-05-19 | Goto Seisakusho:Kk | 半導体装置用放熱板及びその製造方法 |
| JP2009218522A (ja) * | 2008-03-13 | 2009-09-24 | Shindengen Electric Mfg Co Ltd | 樹脂封止半導体装置の製造方法および樹脂封止半導体装置 |
-
1985
- 1985-03-15 JP JP1985037316U patent/JPS61153348U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07130915A (ja) * | 1993-11-04 | 1995-05-19 | Goto Seisakusho:Kk | 半導体装置用放熱板及びその製造方法 |
| JP2009218522A (ja) * | 2008-03-13 | 2009-09-24 | Shindengen Electric Mfg Co Ltd | 樹脂封止半導体装置の製造方法および樹脂封止半導体装置 |