JPS6118335B2 - - Google Patents

Info

Publication number
JPS6118335B2
JPS6118335B2 JP55175577A JP17557780A JPS6118335B2 JP S6118335 B2 JPS6118335 B2 JP S6118335B2 JP 55175577 A JP55175577 A JP 55175577A JP 17557780 A JP17557780 A JP 17557780A JP S6118335 B2 JPS6118335 B2 JP S6118335B2
Authority
JP
Japan
Prior art keywords
molding
resin
temperature
resins
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55175577A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5799759A (en
Inventor
Hiroyuki Fujii
Kenichi Tateno
Kensaku Morii
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55175577A priority Critical patent/JPS5799759A/ja
Publication of JPS5799759A publication Critical patent/JPS5799759A/ja
Publication of JPS6118335B2 publication Critical patent/JPS6118335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP55175577A 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part Granted JPS5799759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55175577A JPS5799759A (en) 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55175577A JPS5799759A (en) 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part

Publications (2)

Publication Number Publication Date
JPS5799759A JPS5799759A (en) 1982-06-21
JPS6118335B2 true JPS6118335B2 (mo) 1986-05-12

Family

ID=15998510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55175577A Granted JPS5799759A (en) 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part

Country Status (1)

Country Link
JP (1) JPS5799759A (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019189826A1 (ja) 2018-03-29 2019-10-03 朝日インテック株式会社 カテーテル、及び、再開通カテーテルシステム

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2579142B2 (ja) * 1984-08-22 1997-02-05 三菱電機株式会社 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019189826A1 (ja) 2018-03-29 2019-10-03 朝日インテック株式会社 カテーテル、及び、再開通カテーテルシステム

Also Published As

Publication number Publication date
JPS5799759A (en) 1982-06-21

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