JPS6123344A - 半導体集積回路の製造方法 - Google Patents
半導体集積回路の製造方法Info
- Publication number
- JPS6123344A JPS6123344A JP59142438A JP14243884A JPS6123344A JP S6123344 A JPS6123344 A JP S6123344A JP 59142438 A JP59142438 A JP 59142438A JP 14243884 A JP14243884 A JP 14243884A JP S6123344 A JPS6123344 A JP S6123344A
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- wiring
- insulating film
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6338—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition the reactions being activated by other means than plasma or thermal, e.g. photo-CVD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/694—Inorganic materials composed of nitrides
- H10P14/6943—Inorganic materials composed of nitrides containing silicon
- H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59142438A JPS6123344A (ja) | 1984-07-11 | 1984-07-11 | 半導体集積回路の製造方法 |
| DE8585108627T DE3576056D1 (de) | 1984-07-11 | 1985-07-11 | Verfahren zum herstellen einer integrierten halbleiterschaltung unter verwendung eines organischen filmes. |
| EP85108627A EP0171605B1 (en) | 1984-07-11 | 1985-07-11 | Method of forming an insulating film on a semiconductor body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59142438A JPS6123344A (ja) | 1984-07-11 | 1984-07-11 | 半導体集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6123344A true JPS6123344A (ja) | 1986-01-31 |
| JPH0334851B2 JPH0334851B2 (2) | 1991-05-24 |
Family
ID=15315315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59142438A Granted JPS6123344A (ja) | 1984-07-11 | 1984-07-11 | 半導体集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6123344A (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190421A (ja) * | 1984-10-11 | 1986-05-08 | Canon Inc | 堆積膜形成方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5568655A (en) * | 1978-11-20 | 1980-05-23 | Fujitsu Ltd | Manufacturing method of wiring |
| JPS5958819A (ja) * | 1982-09-29 | 1984-04-04 | Hitachi Ltd | 薄膜形成方法 |
-
1984
- 1984-07-11 JP JP59142438A patent/JPS6123344A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5568655A (en) * | 1978-11-20 | 1980-05-23 | Fujitsu Ltd | Manufacturing method of wiring |
| JPS5958819A (ja) * | 1982-09-29 | 1984-04-04 | Hitachi Ltd | 薄膜形成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190421A (ja) * | 1984-10-11 | 1986-05-08 | Canon Inc | 堆積膜形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334851B2 (2) | 1991-05-24 |
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