JPS61241978A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS61241978A JPS61241978A JP61004450A JP445086A JPS61241978A JP S61241978 A JPS61241978 A JP S61241978A JP 61004450 A JP61004450 A JP 61004450A JP 445086 A JP445086 A JP 445086A JP S61241978 A JPS61241978 A JP S61241978A
- Authority
- JP
- Japan
- Prior art keywords
- abutment
- layer
- gate
- drain
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
- H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
- H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H10D64/01326—Aspects related to lithography, isolation or planarisation of the conductor
- H10D64/0133—Aspects related to lithography, isolation or planarisation of the conductor at least part of the entire electrode being a sidewall spacer, being formed by transformation under a mask or being formed by plating at a sidewall
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0163—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including enhancement-mode IGFETs and depletion-mode IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US724147 | 1985-04-17 | ||
| US06/724,147 US4649638A (en) | 1985-04-17 | 1985-04-17 | Construction of short-length electrode in semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61241978A true JPS61241978A (ja) | 1986-10-28 |
| JPH058870B2 JPH058870B2 (2) | 1993-02-03 |
Family
ID=24909225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61004450A Granted JPS61241978A (ja) | 1985-04-17 | 1986-01-14 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4649638A (2) |
| EP (1) | EP0198446B1 (2) |
| JP (1) | JPS61241978A (2) |
| CA (1) | CA1232370A (2) |
| DE (1) | DE3676536D1 (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990013918A1 (en) * | 1989-05-12 | 1990-11-15 | Oki Electric Industry Co., Ltd. | Field effect transistor |
| US5946501A (en) * | 1994-05-24 | 1999-08-31 | Asahi Kogaku Kogyo Kabushiki Kaisha | Waterproof and/or water-resistant camera |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0416141A1 (de) * | 1989-09-04 | 1991-03-13 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines FET mit asymmetrisch angeordnetem Gate-Bereich |
| IT1239707B (it) * | 1990-03-15 | 1993-11-15 | St Microelectrics Srl | Processo per la realizzazione di una cella di memoria rom a bassa capacita' di drain |
| JPH0521310A (ja) * | 1991-07-11 | 1993-01-29 | Canon Inc | 微細パタン形成方法 |
| EP0575688B1 (en) * | 1992-06-26 | 1998-05-27 | STMicroelectronics S.r.l. | Programming of LDD-ROM cells |
| KR100221627B1 (ko) | 1996-07-29 | 1999-09-15 | 구본준 | 반도체장치 및 그의 제조방법 |
| US5926708A (en) * | 1997-05-20 | 1999-07-20 | International Business Machines Corp. | Method for providing multiple gate oxide thicknesses on the same wafer |
| US6482660B2 (en) | 2001-03-19 | 2002-11-19 | International Business Machines Corporation | Effective channel length control using ion implant feed forward |
| US20070166971A1 (en) * | 2006-01-17 | 2007-07-19 | Atmel Corporation | Manufacturing of silicon structures smaller than optical resolution limits |
| CN110957370B (zh) * | 2019-12-27 | 2022-08-23 | 杰华特微电子股份有限公司 | 横向双扩散晶体管的制造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4037307A (en) * | 1975-03-21 | 1977-07-26 | Bell Telephone Laboratories, Incorporated | Methods for making transistor structures |
| NL7706802A (nl) * | 1977-06-21 | 1978-12-27 | Philips Nv | Werkwijze voor het vervaardigen van een half- geleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze. |
| US4234362A (en) * | 1978-11-03 | 1980-11-18 | International Business Machines Corporation | Method for forming an insulator between layers of conductive material |
| US4209350A (en) * | 1978-11-03 | 1980-06-24 | International Business Machines Corporation | Method for forming diffusions having narrow dimensions utilizing reactive ion etching |
| US4256514A (en) * | 1978-11-03 | 1981-03-17 | International Business Machines Corporation | Method for forming a narrow dimensioned region on a body |
| US4313782A (en) * | 1979-11-14 | 1982-02-02 | Rca Corporation | Method of manufacturing submicron channel transistors |
| US4312680A (en) * | 1980-03-31 | 1982-01-26 | Rca Corporation | Method of manufacturing submicron channel transistors |
| US4358340A (en) * | 1980-07-14 | 1982-11-09 | Texas Instruments Incorporated | Submicron patterning without using submicron lithographic technique |
| US4334348A (en) * | 1980-07-21 | 1982-06-15 | Data General Corporation | Retro-etch process for forming gate electrodes of MOS integrated circuits |
| US4430791A (en) * | 1981-12-30 | 1984-02-14 | International Business Machines Corporation | Sub-micrometer channel length field effect transistor process |
| US4542577A (en) * | 1982-12-30 | 1985-09-24 | International Business Machines Corporation | Submicron conductor manufacturing |
| US4503601A (en) * | 1983-04-18 | 1985-03-12 | Ncr Corporation | Oxide trench structure for polysilicon gates and interconnects |
| US4546535A (en) * | 1983-12-12 | 1985-10-15 | International Business Machines Corporation | Method of making submicron FET structure |
| US4539744A (en) * | 1984-02-03 | 1985-09-10 | Fairchild Camera & Instrument Corporation | Semiconductor planarization process and structures made thereby |
| US4532698A (en) * | 1984-06-22 | 1985-08-06 | International Business Machines Corporation | Method of making ultrashort FET using oblique angle metal deposition and ion implantation |
-
1985
- 1985-04-17 US US06/724,147 patent/US4649638A/en not_active Expired - Fee Related
-
1986
- 1986-01-14 JP JP61004450A patent/JPS61241978A/ja active Granted
- 1986-02-25 CA CA000502704A patent/CA1232370A/en not_active Expired
- 1986-04-11 DE DE8686105001T patent/DE3676536D1/de not_active Expired - Lifetime
- 1986-04-11 EP EP86105001A patent/EP0198446B1/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990013918A1 (en) * | 1989-05-12 | 1990-11-15 | Oki Electric Industry Co., Ltd. | Field effect transistor |
| US5281547A (en) * | 1989-05-12 | 1994-01-25 | Oki Electric Industry Co., Ltd. | Method for manufacturing a field effect transistor |
| US5946501A (en) * | 1994-05-24 | 1999-08-31 | Asahi Kogaku Kogyo Kabushiki Kaisha | Waterproof and/or water-resistant camera |
Also Published As
| Publication number | Publication date |
|---|---|
| US4649638A (en) | 1987-03-17 |
| EP0198446A2 (en) | 1986-10-22 |
| CA1232370A (en) | 1988-02-02 |
| JPH058870B2 (2) | 1993-02-03 |
| EP0198446B1 (en) | 1990-12-27 |
| EP0198446A3 (en) | 1988-04-27 |
| DE3676536D1 (de) | 1991-02-07 |
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