JPS61246U - 半導体パツケ−ジ - Google Patents

半導体パツケ−ジ

Info

Publication number
JPS61246U
JPS61246U JP1984084629U JP8462984U JPS61246U JP S61246 U JPS61246 U JP S61246U JP 1984084629 U JP1984084629 U JP 1984084629U JP 8462984 U JP8462984 U JP 8462984U JP S61246 U JPS61246 U JP S61246U
Authority
JP
Japan
Prior art keywords
semiconductor package
abstract
cap
view
corners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984084629U
Other languages
English (en)
Inventor
昭広 奥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1984084629U priority Critical patent/JPS61246U/ja
Publication of JPS61246U publication Critical patent/JPS61246U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａおよびｂは本考案にかかるキャビテイダウン型
パッケージの断面図と平面図（同図ａは同図ｂのＢＢ断
面図）、第２図ａおよびｂは従来のキャビテイダウン型
パッケージの断面図と平面図（同図ａは同図ｂの品断面
図）を示している。 図において、１はセラミック製パッケージ、２はキャッ
プ、３は半導体チップ、４は放熱板、５はリード端子、
６は溶着部、１０は溜り孔、を示している。

Claims (1)

    【実用新案登録請求の範囲】
  1. キャップが接着される溶着部の四隅に、溶着材が流れ込
    む溜り孔が設けられていることを特徴とする半導体パッ
    ケージ。
JP1984084629U 1984-06-06 1984-06-06 半導体パツケ−ジ Pending JPS61246U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984084629U JPS61246U (ja) 1984-06-06 1984-06-06 半導体パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984084629U JPS61246U (ja) 1984-06-06 1984-06-06 半導体パツケ−ジ

Publications (1)

Publication Number Publication Date
JPS61246U true JPS61246U (ja) 1986-01-06

Family

ID=30634305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984084629U Pending JPS61246U (ja) 1984-06-06 1984-06-06 半導体パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS61246U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992553A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd パツケ−ジおよびそれを用いた半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992553A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd パツケ−ジおよびそれを用いた半導体装置

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