JPS6142843U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6142843U
JPS6142843U JP1984126686U JP12668684U JPS6142843U JP S6142843 U JPS6142843 U JP S6142843U JP 1984126686 U JP1984126686 U JP 1984126686U JP 12668684 U JP12668684 U JP 12668684U JP S6142843 U JPS6142843 U JP S6142843U
Authority
JP
Japan
Prior art keywords
bump electrode
semiconductor equipment
bonded
connecting conductor
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984126686U
Other languages
English (en)
Inventor
彰 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1984126686U priority Critical patent/JPS6142843U/ja
Publication of JPS6142843U publication Critical patent/JPS6142843U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例ｊこおけるバンプ電極形成工
程を順次示す断面図、第２図は従来のバンプ電極のリー
ド線との熱圧着工程を示す断面図、第３図はその圧着後
の状態を示す断面図、第４図は圧着後のバンプ電極間の
短絡を示す平面図、第５図はバンプ電極形成前の状態を
示す断面図、第６図は従来のバンプ電極形成後の状態を
示す断面図である。 １：シリコン基板、３：アルミニウム電極膜、・ ５：
密着金属層、６：バリヤ金属層、７：バンプ電極、８：
リード線、９：すずめつき層、１０：ボンデイングッー
ル、７１：芯体、７２：金層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子上にバンプ電極が設けられ、該バンプ電極と
    接続導体が熱圧着により結合されるものにおいて、バン
    プ電極が硬い金属よりなる芯体と１７ その接続
    導体との結合側に被着された軟らかい金属層とよりなる
    ことを特徴とする半導体装置。
JP1984126686U 1984-08-21 1984-08-21 半導体装置 Pending JPS6142843U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984126686U JPS6142843U (ja) 1984-08-21 1984-08-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984126686U JPS6142843U (ja) 1984-08-21 1984-08-21 半導体装置

Publications (1)

Publication Number Publication Date
JPS6142843U true JPS6142843U (ja) 1986-03-19

Family

ID=30685358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984126686U Pending JPS6142843U (ja) 1984-08-21 1984-08-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS6142843U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236432U (ja) * 1988-09-01 1990-03-09

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151069A (en) * 1975-06-20 1976-12-25 Matsushita Electric Ind Co Ltd Electrode forming method of a semiconductor element
JPS5285468A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Production of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151069A (en) * 1975-06-20 1976-12-25 Matsushita Electric Ind Co Ltd Electrode forming method of a semiconductor element
JPS5285468A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Production of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236432U (ja) * 1988-09-01 1990-03-09

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