JPS6153852B2 - - Google Patents
Info
- Publication number
- JPS6153852B2 JPS6153852B2 JP53141313A JP14131378A JPS6153852B2 JP S6153852 B2 JPS6153852 B2 JP S6153852B2 JP 53141313 A JP53141313 A JP 53141313A JP 14131378 A JP14131378 A JP 14131378A JP S6153852 B2 JPS6153852 B2 JP S6153852B2
- Authority
- JP
- Japan
- Prior art keywords
- leadless
- package
- wiring board
- printed wiring
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14131378A JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5567154A JPS5567154A (en) | 1980-05-21 |
| JPS6153852B2 true JPS6153852B2 (pl) | 1986-11-19 |
Family
ID=15288986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14131378A Granted JPS5567154A (en) | 1978-11-15 | 1978-11-15 | Method of installing lead-less ic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5567154A (pl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282876U (pl) * | 1988-12-15 | 1990-06-27 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027433U (ja) * | 1983-07-29 | 1985-02-25 | 松下電工株式会社 | 電子部品の実装構造 |
| JPS6078141U (ja) * | 1983-10-31 | 1985-05-31 | 松下電工株式会社 | 電子部品の実装構造 |
| KR100226782B1 (ko) * | 1996-12-06 | 1999-10-15 | 김영환 | 반도체 패키지의 구조 |
-
1978
- 1978-11-15 JP JP14131378A patent/JPS5567154A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282876U (pl) * | 1988-12-15 | 1990-06-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5567154A (en) | 1980-05-21 |
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