JPS6165757U - - Google Patents

Info

Publication number
JPS6165757U
JPS6165757U JP1984150249U JP15024984U JPS6165757U JP S6165757 U JPS6165757 U JP S6165757U JP 1984150249 U JP1984150249 U JP 1984150249U JP 15024984 U JP15024984 U JP 15024984U JP S6165757 U JPS6165757 U JP S6165757U
Authority
JP
Japan
Prior art keywords
thickness
coating layer
alloy
copper
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984150249U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984150249U priority Critical patent/JPS6165757U/ja
Publication of JPS6165757U publication Critical patent/JPS6165757U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるリードフレームを用いた
パツケージの一例の断面図である。第２図はリー
ドフレーム平面図例で、第３図はレジンモールド
ＤＩＰ型半導体の断面図例である。 １：リードフレームのタブ部、２：インナーリ
ード部、３：Ｓｉチツプ、４：接着剤又はろう、
５：金属細線、６：電極パツド、７：樹脂、８：
アウターリード部、９：リードフレーム基材、１
０：Ｎｉ材被覆層、１１：Ｐｄ材薄層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体パツケージに使用されるリードフレーム
    において、銅又は銅合金からなる基材の表面に、
    Ｎｉ又はＣｏ或いはこれらの合金からなる厚さ０
    ．０５μ以上の被覆層が設けられ、少なくもワイ
    ヤボンドされるインナーリーリード部には上記被
    覆層の上に更にＰｄ又はＲｕ或いはこれらの合金
    からなる厚さ０．０１〜０．２μの薄層が設けら
    れていることを特徴とする半導体リードフレーム
    。
JP1984150249U 1984-10-05 1984-10-05 Pending JPS6165757U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984150249U JPS6165757U (ja) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984150249U JPS6165757U (ja) 1984-10-05 1984-10-05

Publications (1)

Publication Number Publication Date
JPS6165757U true JPS6165757U (ja) 1986-05-06

Family

ID=30708402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984150249U Pending JPS6165757U (ja) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPS6165757U (ja)

Similar Documents

Publication Publication Date Title
JPS6232622B2 (ja)
JPS6144849U (ja) 半導体リ−ドフレ−ム
JPS61109146U (ja)
JPS6169842U (ja)
JPS6217152U (ja)
JPH0474453U (ja)
JPS6186948U (ja)
JPS63127127U (ja)
JPS61205144U (ja)
JPS61190148U (ja)
JPS6127252U (ja) 半導体リ−ドフレ−ム用条材
JPS63128740U (ja)
JPS61136554U (ja)
JPH01107157U (ja)
JPS5858354U (ja) 半導体装置用リ−ドフレ−ム
JPH0328752U (ja)
JPH0173935U (ja)
JPH0260236U (ja)
JPH02146449U (ja)
JPH0313754U (ja)
JPS63177043U (ja)
JPS6183047U (ja)
JPS6450448U (ja)
JPH0392053U (ja)
JPH0298635U (ja)