JPH0260236U - - Google Patents

Info

Publication number
JPH0260236U
JPH0260236U JP1988139621U JP13962188U JPH0260236U JP H0260236 U JPH0260236 U JP H0260236U JP 1988139621 U JP1988139621 U JP 1988139621U JP 13962188 U JP13962188 U JP 13962188U JP H0260236 U JPH0260236 U JP H0260236U
Authority
JP
Japan
Prior art keywords
lead frame
pellet
bonded
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988139621U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988139621U priority Critical patent/JPH0260236U/ja
Publication of JPH0260236U publication Critical patent/JPH0260236U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例にかかる半導体装置
の一部破断斜視図、第２図は同実施例に使用され
るリードフレームの断面図、第３図は従来の半導
体装置に使用されるリードフレームの断面図であ
る。 １……半導体ペレツト、２……リードフレーム
、２１……基板、２２……純銅層、３……ペレツ
トマウント部、４……リード、５……ワイヤ、６
……樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 銅製の基板の表面を基板よりも軟らかい純銅層
    で被覆したリードフレームのペレツトマウント部
    に、半導体ペレツトをダイボンデイングし、該半
    導体ペレツトの電極と該電極に近接する上記リー
    ドフレームより延びる各リードとをワイヤボンデ
    イングして樹脂モールドパツケージしたことを特
    徴とする半導体装置。
JP1988139621U 1988-10-26 1988-10-26 Pending JPH0260236U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988139621U JPH0260236U (ja) 1988-10-26 1988-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988139621U JPH0260236U (ja) 1988-10-26 1988-10-26

Publications (1)

Publication Number Publication Date
JPH0260236U true JPH0260236U (ja) 1990-05-02

Family

ID=31403046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988139621U Pending JPH0260236U (ja) 1988-10-26 1988-10-26

Country Status (1)

Country Link
JP (1) JPH0260236U (ja)

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