JPS616848A - 配線基板 - Google Patents

配線基板

Info

Publication number
JPS616848A
JPS616848A JP59126787A JP12678784A JPS616848A JP S616848 A JPS616848 A JP S616848A JP 59126787 A JP59126787 A JP 59126787A JP 12678784 A JP12678784 A JP 12678784A JP S616848 A JPS616848 A JP S616848A
Authority
JP
Japan
Prior art keywords
thickness
lead
wiring
bonding
uniform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59126787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423836B2 (2
Inventor
Manabu Bonshihara
學 盆子原
Kazufumi Terachi
寺地　和文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59126787A priority Critical patent/JPS616848A/ja
Publication of JPS616848A publication Critical patent/JPS616848A/ja
Publication of JPH0423836B2 publication Critical patent/JPH0423836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP59126787A 1984-06-20 1984-06-20 配線基板 Granted JPS616848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59126787A JPS616848A (ja) 1984-06-20 1984-06-20 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59126787A JPS616848A (ja) 1984-06-20 1984-06-20 配線基板

Publications (2)

Publication Number Publication Date
JPS616848A true JPS616848A (ja) 1986-01-13
JPH0423836B2 JPH0423836B2 (2) 1992-04-23

Family

ID=14943924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59126787A Granted JPS616848A (ja) 1984-06-20 1984-06-20 配線基板

Country Status (1)

Country Link
JP (1) JPS616848A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093183A1 (ja) * 1995-03-17 2004-10-28 Atsushi Hino フィルムキャリアおよびこれを用いた半導体装置
EP1970686A2 (en) 2007-03-14 2008-09-17 Nagano Keiki Co., Ltd. Pressure sensor and manufacturing method of said sensor
WO2010007916A1 (ja) * 2008-07-16 2010-01-21 シャープ株式会社 半導体装置および表示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420350U (2) * 1977-07-13 1979-02-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420350U (2) * 1977-07-13 1979-02-09

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093183A1 (ja) * 1995-03-17 2004-10-28 Atsushi Hino フィルムキャリアおよびこれを用いた半導体装置
EP1970686A2 (en) 2007-03-14 2008-09-17 Nagano Keiki Co., Ltd. Pressure sensor and manufacturing method of said sensor
WO2010007916A1 (ja) * 2008-07-16 2010-01-21 シャープ株式会社 半導体装置および表示装置
JP2010027706A (ja) * 2008-07-16 2010-02-04 Sharp Corp 半導体装置および表示装置
US8344486B2 (en) 2008-07-16 2013-01-01 Sharp Kabushiki Kaisha Semiconductor device and display apparatus

Also Published As

Publication number Publication date
JPH0423836B2 (2) 1992-04-23

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