JPS62201932U - - Google Patents

Info

Publication number
JPS62201932U
JPS62201932U JP9078586U JP9078586U JPS62201932U JP S62201932 U JPS62201932 U JP S62201932U JP 9078586 U JP9078586 U JP 9078586U JP 9078586 U JP9078586 U JP 9078586U JP S62201932 U JPS62201932 U JP S62201932U
Authority
JP
Japan
Prior art keywords
pin
heater section
treatment apparatus
heat treatment
mounting means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9078586U
Other languages
Japanese (ja)
Other versions
JPH0521875Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986090785U priority Critical patent/JPH0521875Y2/ja
Publication of JPS62201932U publication Critical patent/JPS62201932U/ja
Application granted granted Critical
Publication of JPH0521875Y2 publication Critical patent/JPH0521875Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第４図は本考案の一実施例を示し、
第１図はヒータ部の上面図、第２図はヒータ部に
ウエハを載置した状態の側面図、第３図ａはピン
の上面図、第３図ｂはピンの側面図、第４図はピ
ン穴の側断面図である。第５図はピンの別例、第
６図及び第７図はそれぞれピン配置の別例を示す
。第８図は線状搬送手段（ワイヤ）を用いる場合
のヒータ部の例の斜視図、第９図は同じく搬送状
態を示す図である。第１０図は従来例を示す。 １…半導体ウエハ、２…ヒータ部、３…ピン穴
、４…ピン。 1 to 4 show an embodiment of the present invention,
Fig. 1 is a top view of the heater section, Fig. 2 is a side view of the wafer placed on the heater section, Fig. 3a is a top view of the pins, Fig. 3b is a side view of the pins, Fig. 4 is a side sectional view of the pin hole. FIG. 5 shows another example of the pin arrangement, and FIGS. 6 and 7 each show another example of the pin arrangement. FIG. 8 is a perspective view of an example of the heater section when linear conveyance means (wire) is used, and FIG. 9 is a diagram similarly showing the conveyance state. FIG. 10 shows a conventional example. 1... Semiconductor wafer, 2... Heater part, 3... Pin hole, 4... Pin.

Claims (1)

【実用新案登録請求の範囲】 半導体ウエハを熱処理するヒータ部と、上記ウ
エハを載置する載置手段とを備える熱処理装置に
おいて、 上記ヒータ部は複数のピン穴が形成され、 上記載置手段は該ピン穴に差し込まれたピンで
あることを特徴とする熱処理装置。[Claims for Utility Model Registration] A heat treatment apparatus comprising a heater section for heat-treating a semiconductor wafer and a mounting means for mounting the wafer, wherein the heater section has a plurality of pin holes formed therein, and the mounting means is provided with a plurality of pin holes. A heat treatment apparatus characterized in that the pin is inserted into the pin hole.
JP1986090785U 1986-06-14 1986-06-14 Expired - Lifetime JPH0521875Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986090785U JPH0521875Y2 (en) 1986-06-14 1986-06-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986090785U JPH0521875Y2 (en) 1986-06-14 1986-06-14

Publications (2)

Publication Number Publication Date
JPS62201932U true JPS62201932U (en) 1987-12-23
JPH0521875Y2 JPH0521875Y2 (en) 1993-06-04

Family

ID=30950968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986090785U Expired - Lifetime JPH0521875Y2 (en) 1986-06-14 1986-06-14

Country Status (1)

Country Link
JP (1) JPH0521875Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737848A (en) * 1980-08-19 1982-03-02 Toshiba Corp Heating apparatus for wafer
JPS5749248A (en) * 1980-09-09 1982-03-23 Fujitsu Ltd Substrate heating and retaining device
JPS6176957U (en) * 1984-10-26 1986-05-23

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737848A (en) * 1980-08-19 1982-03-02 Toshiba Corp Heating apparatus for wafer
JPS5749248A (en) * 1980-09-09 1982-03-23 Fujitsu Ltd Substrate heating and retaining device
JPS6176957U (en) * 1984-10-26 1986-05-23

Also Published As

Publication number Publication date
JPH0521875Y2 (en) 1993-06-04

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