JPS62239593A - 汚染物質の除去方法 - Google Patents

汚染物質の除去方法

Info

Publication number: JPS62239593A
Authority: JP; Japan
Prior art keywords: hole; mask; plasma; contaminants; edges
Prior art date: 1986-04-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP62035952A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0415635B2 (2

Inventor

フランク・ダニエル・エジツト

フランシス・エミ

ウオルター・ユージン・ムリンコ

ロビン・アン・サスコ

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-04-08

Filing date

1987-02-20

Publication date

1987-10-20

1987-02-20 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1987-10-20 Publication of JPS62239593A publication Critical patent/JPS62239593A/ja

1992-03-18 Publication of JPH0415635B2 publication Critical patent/JPH0415635B2/ja

Status Granted legal-status Critical Current

Links

239000000356 contaminant Substances 0.000 title claims description 34
238000000034 method Methods 0.000 title claims description 9
239000007789 gas Substances 0.000 claims description 31
150000002222 fluorine compounds Chemical class 0.000 claims description 22
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
229910052760 oxygen Inorganic materials 0.000 claims description 17
239000001301 oxygen Substances 0.000 claims description 17
238000005530 etching Methods 0.000 claims description 16
239000000758 substrate Substances 0.000 claims description 16
150000001875 compounds Chemical class 0.000 claims description 2
230000002265 prevention Effects 0.000 claims 1
239000000463 material Substances 0.000 description 14
239000004593 Epoxy Substances 0.000 description 13
239000000203 mixture Substances 0.000 description 7
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
238000006243 chemical reaction Methods 0.000 description 6
229920000647 polyepoxide Polymers 0.000 description 6
239000000835 fiber Substances 0.000 description 4
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
238000005553 drilling Methods 0.000 description 3
125000003700 epoxy group Chemical group 0.000 description 3
239000003822 epoxy resin Substances 0.000 description 3
239000003365 glass fiber Substances 0.000 description 3
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
238000007747 plating Methods 0.000 description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
241000238557 Decapoda Species 0.000 description 2
239000004952 Polyamide Substances 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
239000000945 filler Substances 0.000 description 2
229910052731 fluorine Inorganic materials 0.000 description 2
229920002492 poly(sulfone) Polymers 0.000 description 2
229920002647 polyamide Polymers 0.000 description 2
-1 polypropylene Polymers 0.000 description 2
238000012545 processing Methods 0.000 description 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
229920001169 thermoplastic Polymers 0.000 description 2
229920001187 thermosetting polymer Polymers 0.000 description 2
239000004416 thermosoftening plastic Substances 0.000 description 2
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
239000002253 acid Substances 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
125000002723 alicyclic group Chemical group 0.000 description 1
150000008064 anhydrides Chemical class 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000010276 construction Methods 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
239000003989 dielectric material Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000011065 in-situ storage Methods 0.000 description 1
238000009413 insulation Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
239000011968 lewis acid catalyst Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229920003986 novolac Polymers 0.000 description 1
229920000768 polyamine Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
239000004848 polyfunctional curative Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920000098 polyolefin Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000003672 processing method Methods 0.000 description 1
238000004080 punching Methods 0.000 description 1
230000035484 reaction time Effects 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
239000012783 reinforcing fiber Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
239000012261 resinous substance Substances 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
230000000391 smoking effect Effects 0.000 description 1
239000000126 substance Substances 0.000 description 1
150000003512 tertiary amines Chemical class 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Drying Of Semiconductors (AREA)
Cleaning Or Drying Semiconductors (AREA)
Cleaning By Liquid Or Steam (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

JP62035952A 1986-04-08 1987-02-20 汚染物質の除去方法 Granted JPS62239593A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US849247		1986-04-08
US06/849,247 US4654115A (en)	1986-04-08	1986-04-08	Process for removing contaminant

Publications (2)

Publication Number	Publication Date
JPS62239593A true JPS62239593A (ja)	1987-10-20
JPH0415635B2 JPH0415635B2 (2)	1992-03-18

Family

ID=25305397

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP62035952A Granted JPS62239593A (ja)	1986-04-08	1987-02-20	汚染物質の除去方法

Country Status (5)

Country	Link
US (1)	US4654115A (2)
EP (1)	EP0241718B1 (2)
JP (1)	JPS62239593A (2)
CA (1)	CA1314197C (2)
DE (1)	DE3779169D1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02234492A (ja) *	1989-03-07	1990-09-17	Fujitsu Ltd	プリント基板の製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4797178A (en) *	1987-05-13	1989-01-10	International Business Machines Corporation	Plasma etch enhancement with large mass inert gas
US4810326A (en) *	1987-08-31	1989-03-07	International Business Machines Corporation	Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US4787957A (en) *	1987-09-25	1988-11-29	Air Products And Chemicals, Inc.	Desmear and etchback using NF3 /O2 gas mixtures
US4853081A (en) *	1987-10-30	1989-08-01	Ibm Corporation	Process for removing contaminant
US4913789A (en) *	1988-04-18	1990-04-03	Aung David K	Sputter etching and coating process
US5487810A (en) *	1992-03-26	1996-01-30	Bayer Ag	Process for pretreating surfaces of plastic items
DE4410613C1 (de) *	1994-03-26	1995-03-30	Urenco Deutschland Gmbh	Vorrichtung zum Abtragen von Schichten einer Oberfläche mittels Laserstrahlung
IL119246A (en) *	1996-09-12	2000-10-31	Oramir Semiconductor Ltd	Laser removal of foreign materials from surfaces
US5783482A (en) *	1997-09-12	1998-07-21	Taiwan Semiconductor Manufacturing Company, Ltd.	Method to prevent oxide peeling induced by sog etchback on the wafer edge
US6303509B1 (en)	1999-10-29	2001-10-16	Taiwan Semiconductor Manufacturing Company	Method to calibrate the wafer transfer for oxide etcher (with clamp)
US7194803B2 (en) *	2001-07-05	2007-03-27	Flowserve Management Company	Seal ring and method of forming micro-topography ring surfaces with a laser
JP4409134B2 (ja) *	2001-10-09	2010-02-03	パナソニック株式会社	実装システム
US7367114B2 (en) *	2002-08-26	2008-05-06	Littelfuse, Inc.	Method for plasma etching to manufacture electrical devices having circuit protection
US7618895B2 (en) *	2004-12-06	2009-11-17	Asahi Glass Company, Limited	Method for etching doughnut-type glass substrates
CN116321740B (zh) *	2023-03-16	2024-05-31	福莱盈电子股份有限公司	一种双面铜产品通孔的加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4328081A (en) *	1980-02-25	1982-05-04	Micro-Plate, Inc.	Plasma desmearing apparatus and method
US4351697A (en) *	1982-01-04	1982-09-28	Western Electric Company, Inc.	Printed wiring boards
US4582564A (en) *	1982-01-04	1986-04-15	At&T Technologies, Inc.	Method of providing an adherent metal coating on an epoxy surface
US4496420A (en) *	1984-04-06	1985-01-29	Bmc Industries, Inc.	Process for plasma desmear etching of printed circuit boards and apparatus used therein
US4599134A (en) *	1985-06-10	1986-07-08	Ibm Corporation	Plasma etching with tracer

1986
- 1986-04-08 US US06/849,247 patent/US4654115A/en not_active Expired - Fee Related
1987
- 1987-02-20 JP JP62035952A patent/JPS62239593A/ja active Granted
- 1987-02-27 CA CA000530786A patent/CA1314197C/en not_active Expired - Fee Related
- 1987-03-13 DE DE8787103635T patent/DE3779169D1/de not_active Expired - Lifetime
- 1987-03-13 EP EP87103635A patent/EP0241718B1/en not_active Expired - Lifetime

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02234492A (ja) *	1989-03-07	1990-09-17	Fujitsu Ltd	プリント基板の製造方法

Also Published As

Publication number	Publication date
DE3779169D1 (de)	1992-06-25
JPH0415635B2 (2)	1992-03-18
EP0241718B1 (en)	1992-05-20
US4654115A (en)	1987-03-31
EP0241718A2 (en)	1987-10-21
EP0241718A3 (en)	1989-10-18
CA1314197C (en)	1993-03-09

Publication	Publication Date	Title
JPS62239593A (ja)	1987-10-20	汚染物質の除去方法
US6739040B1 (en)	2004-05-25	Method of manufacturing multilayered printed wiring board using adhesive film
EP0395443B1 (en)	1993-02-17	Circuit board and overlay
US4954185A (en)	1990-09-04	Method of applying adherent coating on copper
US4421608A (en)	1983-12-20	Method for stripping peel apart conductive structures
US6739048B2 (en)	2004-05-25	Process of fabricating a circuitized structure
EP0348632B1 (en)	1992-10-14	Processing of cores for circuit boards or cards
EP0313855A2 (en)	1989-05-03	Process for removing contaminant
US6027858A (en)	2000-02-22	Process for tenting PTH's with PID dry film
JPH11177237A (ja)	1999-07-02	ビルドアップ多層プリント配線板とその製造方法
WO2008005094A2 (en)	2008-01-10	Process for increasing the adhesion of a metal surface to a polymer
US4774279A (en)	1988-09-27	Adherent coating for copper
JPH0215644A (ja)	1990-01-19	Ｔａｂ用テープ
JPH0529399A (ja)	1993-02-05	Ｔａｂ用テープ
JP3944801B2 (ja)	2007-07-18	半導体搭載用基板の製造法
JPH03255185A (ja)	1991-11-14	アディティブ法プリント配線板用の接着剤
JP3944802B2 (ja)	2007-07-18	半導体搭載用基板の製造法
US6485892B1 (en)	2002-11-26	Method for masking a hole in a substrate during plating
JPH04314391A (ja)	1992-11-05	アディティブ法プリント配線板用接着剤
WO1992017043A1 (de)	1992-10-01	Lösung zum anquellen von leiterplatten-polymeren vor einem alkalisch-oxydativen ätzschritt und die anwendung dieser lösung
JPH11228669A (ja)	1999-08-24	エポキシ樹脂組成物、プリプレグ、銅張り積層板、多層積層板
JPH05858B2 (2)	1993-01-06
JPS63207423A (ja)	1988-08-26	金属ベ−スプリント配線基板の打抜方法
JPH1117337A (ja)	1999-01-22	多層プリント配線板とその製造法
JPH06105730B2 (ja)	1994-12-21	Ｔａｂ用テープ

JPS62239593A - 汚染物質の除去方法 - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (2)

Publications (2)

Family

ID=25305397

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (15)

Family Cites Families (5)

Cited By (1)

Also Published As

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