JPH0415635B2 - - Google Patents

Info

Publication number: JPH0415635B2
Authority: JP; Japan
Prior art keywords: hole; mask; contaminants; plasma; oxygen
Prior art date: 1986-04-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP62035952A

Other languages

English (en)

Japanese (ja)

Other versions

JPS62239593A (ja

Inventor

Danieru Ejitsuto Furanku

Emi Furanshisu

Yuujin Murinko Uorutaa

An Sasuko Robin

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-04-08

Filing date

1987-02-20

Publication date

1992-03-18

1987-02-20 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1987-10-20 Publication of JPS62239593A publication Critical patent/JPS62239593A/ja

1992-03-18 Publication of JPH0415635B2 publication Critical patent/JPH0415635B2/ja

Status Granted legal-status Critical Current

Links

239000000356 contaminant Substances 0.000 claims description 38
239000007789 gas Substances 0.000 claims description 33
239000000758 substrate Substances 0.000 claims description 27
150000002222 fluorine compounds Chemical class 0.000 claims description 23
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 19
239000001301 oxygen Substances 0.000 claims description 19
229910052760 oxygen Inorganic materials 0.000 claims description 19
238000005530 etching Methods 0.000 claims description 18
238000000034 method Methods 0.000 claims description 8
150000001875 compounds Chemical class 0.000 claims description 3
230000002265 prevention Effects 0.000 claims 1
239000004593 Epoxy Substances 0.000 description 14
239000000463 material Substances 0.000 description 12
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
239000000203 mixture Substances 0.000 description 7
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
229920000647 polyepoxide Polymers 0.000 description 5
238000006243 chemical reaction Methods 0.000 description 4
238000005553 drilling Methods 0.000 description 3
239000003822 epoxy resin Substances 0.000 description 3
239000000835 fiber Substances 0.000 description 3
239000003365 glass fiber Substances 0.000 description 3
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
238000012545 processing Methods 0.000 description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
239000004952 Polyamide Substances 0.000 description 2
WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
238000010586 diagram Methods 0.000 description 2
125000003700 epoxy group Chemical group 0.000 description 2
239000000945 filler Substances 0.000 description 2
238000011065 in-situ storage Methods 0.000 description 2
238000007747 plating Methods 0.000 description 2
229920002492 poly(sulfone) Polymers 0.000 description 2
229920002647 polyamide Polymers 0.000 description 2
-1 polypropylene Polymers 0.000 description 2
238000003825 pressing Methods 0.000 description 2
239000012783 reinforcing fiber Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
229920001169 thermoplastic Polymers 0.000 description 2
229920001187 thermosetting polymer Polymers 0.000 description 2
239000004416 thermosoftening plastic Substances 0.000 description 2
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
229920000459 Nitrile rubber Polymers 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
238000009825 accumulation Methods 0.000 description 1
239000002253 acid Substances 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
235000011037 adipic acid Nutrition 0.000 description 1
239000001361 adipic acid Substances 0.000 description 1
150000001299 aldehydes Chemical class 0.000 description 1
125000002723 alicyclic group Chemical group 0.000 description 1
150000008064 anhydrides Chemical class 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
239000003989 dielectric material Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
238000003682 fluorination reaction Methods 0.000 description 1
229940083124 ganglion-blocking antiadrenergic secondary and tertiary amines Drugs 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000003780 insertion Methods 0.000 description 1
230000037431 insertion Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
239000011968 lewis acid catalyst Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229920003986 novolac Polymers 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
229920000768 polyamine Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
239000004848 polyfunctional curative Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920000098 polyolefin Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
150000003141 primary amines Chemical class 0.000 description 1
238000003672 processing method Methods 0.000 description 1
238000004080 punching Methods 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000000126 substance Substances 0.000 description 1
CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Drying Of Semiconductors (AREA)
Cleaning Or Drying Semiconductors (AREA)
Cleaning By Liquid Or Steam (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

JP62035952A 1986-04-08 1987-02-20 汚染物質の除去方法 Granted JPS62239593A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US849247		1986-04-08
US06/849,247 US4654115A (en)	1986-04-08	1986-04-08	Process for removing contaminant

Publications (2)

Publication Number	Publication Date
JPS62239593A JPS62239593A (ja)	1987-10-20
JPH0415635B2 true JPH0415635B2 (2)	1992-03-18

Family

ID=25305397

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP62035952A Granted JPS62239593A (ja)	1986-04-08	1987-02-20	汚染物質の除去方法

Country Status (5)

Country	Link
US (1)	US4654115A (2)
EP (1)	EP0241718B1 (2)
JP (1)	JPS62239593A (2)
CA (1)	CA1314197C (2)
DE (1)	DE3779169D1 (2)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4797178A (en) *	1987-05-13	1989-01-10	International Business Machines Corporation	Plasma etch enhancement with large mass inert gas
US4810326A (en) *	1987-08-31	1989-03-07	International Business Machines Corporation	Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US4787957A (en) *	1987-09-25	1988-11-29	Air Products And Chemicals, Inc.	Desmear and etchback using NF3 /O2 gas mixtures
US4853081A (en) *	1987-10-30	1989-08-01	Ibm Corporation	Process for removing contaminant
US4913789A (en) *	1988-04-18	1990-04-03	Aung David K	Sputter etching and coating process
JPH02234492A (ja) *	1989-03-07	1990-09-17	Fujitsu Ltd	プリント基板の製造方法
US5487810A (en) *	1992-03-26	1996-01-30	Bayer Ag	Process for pretreating surfaces of plastic items
DE4410613C1 (de) *	1994-03-26	1995-03-30	Urenco Deutschland Gmbh	Vorrichtung zum Abtragen von Schichten einer Oberfläche mittels Laserstrahlung
IL119246A (en) *	1996-09-12	2000-10-31	Oramir Semiconductor Ltd	Laser removal of foreign materials from surfaces
US5783482A (en) *	1997-09-12	1998-07-21	Taiwan Semiconductor Manufacturing Company, Ltd.	Method to prevent oxide peeling induced by sog etchback on the wafer edge
US6303509B1 (en)	1999-10-29	2001-10-16	Taiwan Semiconductor Manufacturing Company	Method to calibrate the wafer transfer for oxide etcher (with clamp)
US7194803B2 (en) *	2001-07-05	2007-03-27	Flowserve Management Company	Seal ring and method of forming micro-topography ring surfaces with a laser
JP4409134B2 (ja) *	2001-10-09	2010-02-03	パナソニック株式会社	実装システム
US7367114B2 (en) *	2002-08-26	2008-05-06	Littelfuse, Inc.	Method for plasma etching to manufacture electrical devices having circuit protection
US7618895B2 (en) *	2004-12-06	2009-11-17	Asahi Glass Company, Limited	Method for etching doughnut-type glass substrates
CN116321740B (zh) *	2023-03-16	2024-05-31	福莱盈电子股份有限公司	一种双面铜产品通孔的加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4328081A (en) *	1980-02-25	1982-05-04	Micro-Plate, Inc.	Plasma desmearing apparatus and method
US4351697A (en) *	1982-01-04	1982-09-28	Western Electric Company, Inc.	Printed wiring boards
US4582564A (en) *	1982-01-04	1986-04-15	At&T Technologies, Inc.	Method of providing an adherent metal coating on an epoxy surface
US4496420A (en) *	1984-04-06	1985-01-29	Bmc Industries, Inc.	Process for plasma desmear etching of printed circuit boards and apparatus used therein
US4599134A (en) *	1985-06-10	1986-07-08	Ibm Corporation	Plasma etching with tracer

1986
- 1986-04-08 US US06/849,247 patent/US4654115A/en not_active Expired - Fee Related
1987
- 1987-02-20 JP JP62035952A patent/JPS62239593A/ja active Granted
- 1987-02-27 CA CA000530786A patent/CA1314197C/en not_active Expired - Fee Related
- 1987-03-13 DE DE8787103635T patent/DE3779169D1/de not_active Expired - Lifetime
- 1987-03-13 EP EP87103635A patent/EP0241718B1/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE3779169D1 (de)	1992-06-25
JPS62239593A (ja)	1987-10-20
EP0241718B1 (en)	1992-05-20
US4654115A (en)	1987-03-31
EP0241718A2 (en)	1987-10-21
EP0241718A3 (en)	1989-10-18
CA1314197C (en)	1993-03-09

Publication	Publication Date	Title
JPH0415635B2 (2)	1992-03-18
US6775907B1 (en)	2004-08-17	Process for manufacturing a printed wiring board
KR100541779B1 (ko)	2006-04-10	에폭시수지조성물및이를사용한다층프린트배선판의제조방법
US4091125A (en)	1978-05-23	Circuit board and method for producing same
US5495665A (en)	1996-03-05	Process for providing a landless via connection
US4313995A (en)	1982-02-02	Circuit board and method for producing same
JPS61168291A (ja)	1986-07-29	基板の表面を粗くする方法
JPH0666547B2 (ja)	1994-08-24	配線板およびその製造方法
EP0235701B1 (en)	1992-06-24	Process for providing a landless through-hole connection
JPH0317390B2 (2)	1991-03-07
US6265075B1 (en)	2001-07-24	Circuitized semiconductor structure and method for producing such
CA1336273C (en)	1995-07-11	Desmear and etchback of printed circuit boards using an nf_/o_ plasma gas mixture
EP0087551B1 (en)	1988-04-20	Method for stripping peel-apart conductive structure
US4089766A (en)	1978-05-16	Method of passivating and planarizing a metallization pattern
US6739048B2 (en)	2004-05-25	Process of fabricating a circuitized structure
JPH0520917B2 (2)	1993-03-22
US4735820A (en)	1988-04-05	Removal of residual catalyst from a dielectric substrate
JPH03173196A (ja)	1991-07-26	無電解金属化用のラミネートおよびこれから作られたプリント回路および該ラミネートの製造法
JPH0586723B2 (2)	1993-12-14
JPH06260763A (ja)	1994-09-16	多層配線基板の製造方法
IE51721B1 (en)	1987-03-04	Process for the manufacture of printed circuits
JPH04314391A (ja)	1992-11-05	アディティブ法プリント配線板用接着剤
JP2000049440A (ja)	2000-02-18	プリント配線用多層板の製造方法
JPH05283843A (ja)	1993-10-29	電気絶縁基板表面又は基板上の電気絶縁層表面への導体パターンの形成方法
JPH08337880A (ja)	1996-12-24	無電解めっき用接着剤の粗化方法およびプリント配線板の製造方法