JPS6224948B2 - - Google Patents

Info

Publication number
JPS6224948B2
JPS6224948B2 JP56171641A JP17164181A JPS6224948B2 JP S6224948 B2 JPS6224948 B2 JP S6224948B2 JP 56171641 A JP56171641 A JP 56171641A JP 17164181 A JP17164181 A JP 17164181A JP S6224948 B2 JPS6224948 B2 JP S6224948B2
Authority
JP
Japan
Prior art keywords
wiring
bump
ceramic substrate
circular
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56171641A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5871646A (ja
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56171641A priority Critical patent/JPS5871646A/ja
Publication of JPS5871646A publication Critical patent/JPS5871646A/ja
Publication of JPS6224948B2 publication Critical patent/JPS6224948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP56171641A 1981-10-24 1981-10-24 半導体装置 Granted JPS5871646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56171641A JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56171641A JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS5871646A JPS5871646A (ja) 1983-04-28
JPS6224948B2 true JPS6224948B2 (fr) 1987-05-30

Family

ID=15926965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56171641A Granted JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS5871646A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0516106U (ja) * 1991-08-05 1993-03-02 株式会社小松製作所 切粉処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
JPS63102399A (ja) * 1986-10-20 1988-05-07 富士通株式会社 多層プリント配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030474A (fr) * 1973-07-17 1975-03-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0516106U (ja) * 1991-08-05 1993-03-02 株式会社小松製作所 切粉処理装置

Also Published As

Publication number Publication date
JPS5871646A (ja) 1983-04-28

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