JPS62257752A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS62257752A
JPS62257752A JP61101599A JP10159986A JPS62257752A JP S62257752 A JPS62257752 A JP S62257752A JP 61101599 A JP61101599 A JP 61101599A JP 10159986 A JP10159986 A JP 10159986A JP S62257752 A JPS62257752 A JP S62257752A
Authority
JP
Japan
Prior art keywords
slags
glass sleeve
lead frame
slug
sleeves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61101599A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0368535B2 (2
Inventor
Kenzo Senba
仙波　謙三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP61101599A priority Critical patent/JPS62257752A/ja
Publication of JPS62257752A publication Critical patent/JPS62257752A/ja
Publication of JPH0368535B2 publication Critical patent/JPH0368535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Led Device Packages (AREA)
JP61101599A 1986-04-30 1986-04-30 半導体装置の製造方法 Granted JPS62257752A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61101599A JPS62257752A (ja) 1986-04-30 1986-04-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61101599A JPS62257752A (ja) 1986-04-30 1986-04-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62257752A true JPS62257752A (ja) 1987-11-10
JPH0368535B2 JPH0368535B2 (2) 1991-10-28

Family

ID=14304852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61101599A Granted JPS62257752A (ja) 1986-04-30 1986-04-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62257752A (2)

Also Published As

Publication number Publication date
JPH0368535B2 (2) 1991-10-28

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