JPS6230348U - - Google Patents

Info

Publication number
JPS6230348U
JPS6230348U JP1985121906U JP12190685U JPS6230348U JP S6230348 U JPS6230348 U JP S6230348U JP 1985121906 U JP1985121906 U JP 1985121906U JP 12190685 U JP12190685 U JP 12190685U JP S6230348 U JPS6230348 U JP S6230348U
Authority
JP
Japan
Prior art keywords
semiconductor
heat sink
semiconductor device
mold resin
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985121906U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985121906U priority Critical patent/JPS6230348U/ja
Publication of JPS6230348U publication Critical patent/JPS6230348U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図〜第３図は本考案の一実施例を示し、第
１図はモジユールの断面図、第２図は一体モール
ド前の半導体装置と放熱板とのレイアウトを示す
斜視図、第３図はモジユールの外観を示す斜視図
である。第４図は本考案の他の実施例の外観斜視
図である。第５図は本考案の応用例を示す断面図
である。第６図は従来の樹脂モールドタイプの半
導体装置の取り付け状態をＴＯ―２２０タイプで
例示する斜視図である。 １０…半導体装置、１１…基板接着部、１２…
半導体基板、１３，１４…放熱板、１５…モール
ド樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームの基板接着部に半導体基板が接
    着され所要の電気配線を施された半導体装置と放
    熱板とがモールド樹脂で一体モールドされ、かつ
    前記半導体装置と前記放熱板との間に前記モール
    ド樹脂が介在せしめられていることを特徴とする
    半導体モジユール。
JP1985121906U 1985-08-08 1985-08-08 Pending JPS6230348U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985121906U JPS6230348U (ja) 1985-08-08 1985-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985121906U JPS6230348U (ja) 1985-08-08 1985-08-08

Publications (1)

Publication Number Publication Date
JPS6230348U true JPS6230348U (ja) 1987-02-24

Family

ID=31011605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985121906U Pending JPS6230348U (ja) 1985-08-08 1985-08-08

Country Status (1)

Country Link
JP (1) JPS6230348U (ja)

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