JPS6236542U - - Google Patents
Info
- Publication number
- JPS6236542U JPS6236542U JP1985128646U JP12864685U JPS6236542U JP S6236542 U JPS6236542 U JP S6236542U JP 1985128646 U JP1985128646 U JP 1985128646U JP 12864685 U JP12864685 U JP 12864685U JP S6236542 U JPS6236542 U JP S6236542U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- substrate
- frame
- seal
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例であり、Ａはその断
面図、Ｂは平面透視図である。第２図Ａは従来の
装置の断面図で、Ｂ図は平面透視図である。 １ａ，２ａ……装置の基板、１ｂ，２ｂ……基
板の配線導体、１ｃ，２ｃ……半導体ペレツト、
１ｄ，２ｄ……ボンデイングワイヤ、１ｆ，２ｆ
……封止樹脂、１ｅ……円形状枠、２ｅ……方形
状枠、２ｇ……樹脂の末充填部。
面図、Ｂは平面透視図である。第２図Ａは従来の
装置の断面図で、Ｂ図は平面透視図である。 １ａ，２ａ……装置の基板、１ｂ，２ｂ……基
板の配線導体、１ｃ，２ｃ……半導体ペレツト、
１ｄ，２ｄ……ボンデイングワイヤ、１ｆ，２ｆ
……封止樹脂、１ｅ……円形状枠、２ｅ……方形
状枠、２ｇ……樹脂の末充填部。
Claims (1)
- 基板上に搭載されたチツプ部品と、このチツプ
部品の外側にとりつけられた円形状枠と、この枠
内に充填されて前記チツプ部品を封止する樹脂と
を有することを特徴とする集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128646U JPS6236542U (ja) | 1985-08-22 | 1985-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128646U JPS6236542U (ja) | 1985-08-22 | 1985-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236542U true JPS6236542U (ja) | 1987-03-04 |
Family
ID=31024507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985128646U Pending JPS6236542U (ja) | 1985-08-22 | 1985-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236542U (ja) |
-
1985
- 1985-08-22 JP JP1985128646U patent/JPS6236542U/ja active Pending